Global Semiconductor Wafer Bonder Market Growth 2025-2031

The global Semiconductor Wafer Bonder market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR of %from 2025 to 2031.

A Semiconductor Wafer Bonder is a precision machine tool used in the fabrication of micro-electrical mechanical systems (MEMS) and other similar technologies. A wafer bonder is used to package together two or more substrates on the wafer-level.



Wafer bonders are used on both R&D and industrial scales when the mechanically stable joining, or bonding, together of two substrates is required. This bonding process can either be temporary or permanent, and a number of methods and technologies have been developed depending on the substrates involved and the applications required. For more information on the commonly used bonding methods, see Inseto’s knowledge base document Wafer bonding methods.

Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.41% year-on-year.

LP Information, Inc. (LPI) ' newest research report, the “Semiconductor Wafer Bonder Industry Forecast” looks at past sales and reviews total world Semiconductor Wafer Bonder sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Wafer Bonder sales for 2025 through 2031. With Semiconductor Wafer Bonder sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Wafer Bonder industry.

This Insight Report provides a comprehensive analysis of the global Semiconductor Wafer Bonder landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Wafer Bonder portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Wafer Bonder market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Wafer Bonder and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Wafer Bonder.

This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Wafer Bonder market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Manual
Semi-automatic
Fully automatic

Segmentation by Application:
Microelectromechanical systems (MEMS)
Nanoelectromechanical systems (NEMS)
Microelectronics
Optoelectronics

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Besi
ASM Pacific Technology
Shibaura
Muehlbauer
Kulicke & Soffa
Hamni
ASM AMICRA
SET
Athlete FA

Key Questions Addressed in this Report

What is the 10-year outlook for the global Semiconductor Wafer Bonder market?

What factors are driving Semiconductor Wafer Bonder market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Semiconductor Wafer Bonder market opportunities vary by end market size?

How does Semiconductor Wafer Bonder break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.