The global Semiconductor Packaging Testing Equipment market size is predicted to grow from US$ 14720 million in 2025 to US$ 21500 million in 2031; it is expected to grow at a CAGR of 6.5% from 2025 to 2031.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
LP Information, Inc. (LPI) ' newest research report, the “Semiconductor Packaging Testing Equipment Industry Forecast” looks at past sales and reviews total world Semiconductor Packaging Testing Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Packaging Testing Equipment sales for 2025 through 2031. With Semiconductor Packaging Testing Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Packaging Testing Equipment industry.
This Insight Report provides a comprehensive analysis of the global Semiconductor Packaging Testing Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Packaging Testing Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Packaging Testing Equipment market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Packaging Testing Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Packaging Testing Equipment.
This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Packaging Testing Equipment market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Semiconductor Testing Equipment
Semiconductor Packaging Equipment
Segmentation by Application:
Integrated Device Manufacturer
Outsourced Semiconductor Assembly and Test (OSAT)
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Teradyne
Advantest
ASM Pacific Technology
DISCO Corporation
Tokyo Seimitsu
Besi
Tokyo Electron
Kulicke & Soffa Industries
Cohu
Semes
Hanmi semiconductor
Yamaha Robotics Holdings
Techwing
Fasford (FUJI)
Chroma
Hangzhou Changchuan Technology
Beijing Huafeng Test and Control Technology
Toray Engineering
Palomar Technologies
Shibasoku
SPEA
Hesse GmbH
Key Questions Addressed in this Report
What is the 10-year outlook for the global Semiconductor Packaging Testing Equipment market?
What factors are driving Semiconductor Packaging Testing Equipment market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Semiconductor Packaging Testing Equipment market opportunities vary by end market size?
How does Semiconductor Packaging Testing Equipment break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
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