Global Semiconductor Packaging and Testing Equipment Market Growth 2025-2031

Global Semiconductor Packaging and Testing Equipment Market Growth 2025-2031

The global Semiconductor Packaging and Testing Equipment market size is predicted to grow from US$ 14220 million in 2025 to US$ 20470 million in 2031; it is expected to grow at a CAGR of 6.3% from 2025 to 2031.

Packaging is the process of laying out, fixing and connecting the chip on the substrate, and encapsulating it with a plastic insulating medium to form an electronic product. The purpose is to protect the chip from damage, ensure the heat dissipation performance of the chip, and realize the transmission of electrical energy and electrical signals to ensure the normal operation of the system. The specific processing links of semiconductor packaging mainly include grinding, wafer cutting, wire bonding, plastic sealing, electroplating, cutting/molding and other links. The packaging equipment mainly includes mounters, cutting and thinning equipment, wire machines, bonding machines, electroplating equipment, etc.

Testing is mainly a step to verify the functions and performance of semiconductor products such as chips and circuits. Its purpose is to screen out semiconductor products with structural defects and functions and performance that do not meet the requirements to ensure the normal application of the delivered products. Testing equipment mainly includes testers, probe stations and sorting machines.

Strong market demand and strong support from national policies are the main driving forces for the rapid development of the domestic semiconductor industry. Mainland China is the world's largest market for semiconductor products, mainly because it is the world's factory. The main production bases of electronic products such as televisions, computers, mobile phones, and home appliances are located in the mainland. Therefore, the mainland consumes about half of the world's semiconductor products. On the other hand, with the rise of terminal brand manufacturers in mainland China, the demand for semiconductor products from mainland own-brand manufacturers has increased significantly. The growth of domestic semiconductor and microelectronics market demand has driven the development of the semiconductor packaging industry. The semiconductor and microelectronics industry is in a continuous development cycle. The market demand for electronic information products such as computers, communications, and consumer electronics drives the development of the integrated circuit industry. The development of the semiconductor and microelectronics industry drives the development of the semiconductor packaging and testing equipment industry.

In terms of product types and technologies, semiconductor packaging equipment accounts for a high proportion, with a market size of US$7.843 billion in 2023, accounting for approximately 53.94% of total sales. In terms of product market applications, packaging and testing & wafer foundries account for a high proportion, with a market size of US$11.002 billion in 2023, accounting for approximately 75.68% of total sales

The continuous increase in downstream demand has led to the emergence of a number of new companies in the semiconductor field. In order to save costs and increase gross profit margins, these start-ups will choose to outsource their semiconductor manufacturing and packaging and testing to wafer and packaging and testing foundries. The booming packaging and testing foundry business has also led to an increasing demand for semiconductor packaging and testing equipment from wafer and packaging and testing foundries. We believe that the trend of packaging and testing outsourcing will not change in the short term, so the application of semiconductor packaging and testing equipment in this field is showing a slight growth trend.

LP Information, Inc. (LPI) ' newest research report, the “Semiconductor Packaging and Testing Equipment Industry Forecast” looks at past sales and reviews total world Semiconductor Packaging and Testing Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Packaging and Testing Equipment sales for 2025 through 2031. With Semiconductor Packaging and Testing Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Packaging and Testing Equipment industry.

This Insight Report provides a comprehensive analysis of the global Semiconductor Packaging and Testing Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Packaging and Testing Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Packaging and Testing Equipment market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Packaging and Testing Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Packaging and Testing Equipment.

This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Packaging and Testing Equipment market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Semiconductor Testing Equipment
Semiconductor Packaging Equipment

Segmentation by Application:
IDM Enterprise
Foundry

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Teradyne
Advantest
ASM Pacific Technology
Disco
Tokyo Seimitsu
Besi
Tokyo Electron
Kulicke & Soffa Industries
Cohu
Semes
Hanmi semiconductor
Yamaha Robotics Holdings
Techwing
Fasford (FUJI)
Chroma
CCTECH
Beijing Huafeng Test & Control Technology
Toray Engineering
Palomar Technologies
Shibasoku
SPEA
Hesse
Unicomp Technology

Key Questions Addressed in this Report

What is the 10-year outlook for the global Semiconductor Packaging and Testing Equipment market?

What factors are driving Semiconductor Packaging and Testing Equipment market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Semiconductor Packaging and Testing Equipment market opportunities vary by end market size?

How does Semiconductor Packaging and Testing Equipment break out by Type, by Application?

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