Global Semiconductor Packaging and Test Equipment Market Growth 2025-2031

Global Semiconductor Packaging and Test Equipment Market Growth 2025-2031

The global Semiconductor Packaging and Test Equipment market size is predicted to grow from US$ 12730 million in 2025 to US$ 18290 million in 2031; it is expected to grow at a CAGR of 6.2% from 2025 to 2031.

The rapid expansion of semiconductor chip application is one of the primary factors contributing to the growth of the semiconductor packaging and test market in China. The use of semiconductor chips has expanded broadly with rising demands from various industries such as power, energy, medical, green cars, networking and telecommunications, LED lighting, automobile, consumer applications, military, aerospace and defense, motor control applications, and robotics.

In China and China Taiwan, Semiconductor Packaging and Test Equipment key players include TEL, DISCO, ASM, etc. China and China Taiwan top three manufacturers hold a share over 40%.

In terms of product, Wafer Probe Station is the largest segment of Cobalt, with a share over 35%. And in terms of application, the largest application is OSAT, followed by IDMs.

LP Information, Inc. (LPI) ' newest research report, the “Semiconductor Packaging and Test Equipment Industry Forecast” looks at past sales and reviews total world Semiconductor Packaging and Test Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Packaging and Test Equipment sales for 2025 through 2031. With Semiconductor Packaging and Test Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Packaging and Test Equipment industry.

This Insight Report provides a comprehensive analysis of the global Semiconductor Packaging and Test Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Packaging and Test Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Packaging and Test Equipment market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Packaging and Test Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Packaging and Test Equipment.

This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Packaging and Test Equipment market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Wafer Probe Station
Die Bonder
Dicing Machine
Test handler
Sorter

Segmentation by Application:
Integrated Device Manufacturer (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
TEL
DISCO
ASM
Tokyo Seimitsu
Besi
Semes
Cohu, Inc.
Techwing
Kulicke & Soffa Industries
Fasford
Advantest
Hanmi semiconductor
Shinkawa
Shen Zhen Sidea
DIAS Automation

Key Questions Addressed in this Report

What is the 10-year outlook for the global Semiconductor Packaging and Test Equipment market?

What factors are driving Semiconductor Packaging and Test Equipment market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Semiconductor Packaging and Test Equipment market opportunities vary by end market size?

How does Semiconductor Packaging and Test Equipment break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.