Global Semiconductor Packaging Materials Market Growth (Status and Outlook) 2025-2031
The global Semiconductor Packaging Materials market size is predicted to grow from US$ 33490 million in 2025 to US$ 71540 million in 2031; it is expected to grow at a CAGR of 13.5% from 2025 to 2031.
Semiconductor packaging has four main functions: protection, support, connection and reliability. It protects the chip to operate normally in various environments, supports the chip to facilitate connection with the circuit, and connects the electrode of the chip with the external circuit to form reliability and can Used in various applications. This report focusses on Semiconductor Packaging Materials market.
A semiconductor is a substance that conducts electricity under some but not all circumstances. Manufacturers are able to customize the conductivity of a semiconductor, such as introducing a sensitivity to heat or light, or altering conductivity based on the direction of the current. Semiconductors are an important component of many commonly used electronic devices including smartphones, tablets, and PCs. Notable semiconductor chip makers include Intel and Samsung Electronics, with Intel generating 48.7 billion U.S. dollars and Samsung generating 39.9 billion U.S. dollars in semiconductor revenue in 2023, placing them among the largest companies in terms of semiconductor industry revenues. The semiconductor industry comprises companies that design, fabricate, assemble, test, and supply semiconductors that are suitable for various applications. In 2024, semiconductor sales were expected to reach 611.23 billion U.S. dollars worldwide. Semiconductors are crucial components of electronics devices and the industry is highly competitive. The year-on-year decline rate in 2023 equated to 9.4 percent, although a swift recovery is expected in 2024 with growth of 16 percent. The growing global consumer electronics consumption further supports the market growth. In addition, the development of artificial intelligence (AI), the Internet of Things (IoT), and machine learning (ML) technologies in the new age of electronic systems is generating lucrative market growth opportunities. These technologies assist and enhance memory chip processing time to process large amounts of data in no time. Moreover, the potentially rising demand for faster and more advanced memory chips in data center applications is expected to drive the market growth over the forecast timeline. Global Semiconductor Packaging Materials includes Kyocera, Shinko, and Ibiden, etc. Global top three companies hold a share over 22%.
LPI (LP Information)' newest research report, the “Semiconductor Packaging Materials Industry Forecast” looks at past sales and reviews total world Semiconductor Packaging Materials sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Packaging Materials sales for 2025 through 2031. With Semiconductor Packaging Materials sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Packaging Materials industry.
This Insight Report provides a comprehensive analysis of the global Semiconductor Packaging Materials landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Semiconductor Packaging Materials portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Packaging Materials market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Packaging Materials and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Packaging Materials.
This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Packaging Materials market by product type, application, key players and key regions and countries.
Segmentation by Type:
Packaging Substrate
Lead Frame
Bonding Wire
Encapsulating Resin
Ceramic Packaging Material
Chip Bonding Material
Others
Segmentation by Application:
Consume Electrons
Automobiles
Communications
Medical
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Kyocera
Shinko
Ibiden
LG Innotek
Unimicron Technology
ZhenDing Tech
Semco
KINSUS INTERCONNECT TECHNOLOGY
Nan Ya PCB
Nippon Micrometal Corporation
Simmtech
Mitsui High-tec, Inc.
HAESUNG
Shin-Etsu
Heraeus
AAMI
Henkel
Shennan Circuits
Kangqiang Electronics
LG Chem
NGK/NTK
MK Electron
Toppan Printing Co., Ltd.
Tanaka
MARUWA
Momentive
SCHOTT
Element Solutions
Hitachi Chemical
Fastprint
Hongchang Electronic
Sumitomo
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