Global Semiconductor Packaging (IDM) Market Growth (Status and Outlook) 2024-2030

Global Semiconductor Packaging (IDM) Market Growth (Status and Outlook) 2024-2030

“Integrated Device Manufacturer (IDM)” refers to corporations that handles all processes in manufacturing semiconductors. This means one corporation has the fab*, the wafer-producing facility, and also takes charge in designing the semiconductors, wafer processing, packaging, and testing.

This report studies the IC packaging of IDM companies.

The global Semiconductor Packaging (IDM) market size is projected to grow from US$ 30420 million in 2024 to US$ 41160 million in 2030; it is expected to grow at a CAGR of 5.2% from 2024 to 2030.

LPI (LP Information)' newest research report, the “Semiconductor Packaging (IDM) Industry Forecast” looks at past sales and reviews total world Semiconductor Packaging (IDM) sales in 2022, providing a comprehensive analysis by region and market sector of projected Semiconductor Packaging (IDM) sales for 2023 through 2029. With Semiconductor Packaging (IDM) sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Packaging (IDM) industry.

This Insight Report provides a comprehensive analysis of the global Semiconductor Packaging (IDM) landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Semiconductor Packaging (IDM) portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Packaging (IDM) market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Packaging (IDM) and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Packaging (IDM).

United States market for Semiconductor Packaging (IDM) is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.

China market for Semiconductor Packaging (IDM) is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.

Europe market for Semiconductor Packaging (IDM) is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.

Global key Semiconductor Packaging (IDM) players cover Samsung, Intel, SK Hynix, Micron Technology, Texas Instruments (TI), etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2023.

This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Packaging (IDM) market by product type, application, key players and key regions and countries.

Segmentation by Type:
Advanced Packaging
Traditional Packaging

Segmentation by Application:
Communication
Computer/PC
Consumer
Automotive
Industrial
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

Segmentation by Type:
Advanced Packaging
Traditional Packaging

Segmentation by Application:
Communication
Computer/PC
Consumer
Automotive
Industrial
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Samsung
Intel
SK Hynix
Micron Technology
Texas Instruments (TI)
STMicroelectronics
Kioxia
Western Digital
Infineon
NXP
Analog Devices, Inc. (ADI)
Renesas
Microchip Technology
Onsemi
Sony Semiconductor Solutions Corporation
Panasonic
Winbond
Nanya Technology
ISSI (Integrated Silicon Solution Inc.)
Macronix
Giantec Semiconductor
Sharp
Magnachip
Toshiba
JS Foundry KK.
Hitachi
Murata
Skyworks Solutions Inc
Wolfspeed
Littelfuse
Diodes Incorporated
Rohm
Fuji Electric
Vishay Intertechnology
Mitsubishi Electric
Nexperia
Ampleon
CR Micro
Hangzhou Silan Integrated Circuit
Jilin Sino-Microelectronics
Jiangsu Jiejie Microelectronics
Suzhou Good-Ark Electronics
Zhuzhou CRRC Times Electric
BYD

Please note: The report will take approximately 2 business days to prepare and deliver.