Global Semiconductor Packaging Equipment Market Growth 2023-2029

Global Semiconductor Packaging Equipment Market Growth 2023-2029

Semiconductor packaging is carried out to provide extra protection to wafers or substrates. The package casing is made up of materials such as metal, plastic, glass, or ceramic and contains one or more semiconductor electronic components.

LPI (LP Information)' newest research report, the “Semiconductor Packaging Equipment Industry Forecast” looks at past sales and reviews total world Semiconductor Packaging Equipment sales in 2022, providing a comprehensive analysis by region and market sector of projected Semiconductor Packaging Equipment sales for 2023 through 2029. With Semiconductor Packaging Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Packaging Equipment industry.

This Insight Report provides a comprehensive analysis of the global Semiconductor Packaging Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Packaging Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global Semiconductor Packaging Equipment market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Packaging Equipment and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Packaging Equipment.

The global Semiconductor Packaging Equipment market size is projected to grow from US$ 5693.4 million in 2022 to US$ 6573.6 million in 2029; it is expected to grow at a CAGR of 6573.6 from 2023 to 2029.

Accounting for more than 55% of the total market shares, the die-level packaging equipment segment dominated the market. This growth can be attributed to the increasing demand for application processors, basebands, and SoCs, which are integrated into mobile and consumer electronic devices. Though the market shares of this segment will decline due to the use of advanced technologies, this segment will continue to dominate the market throughout the forecast period.

This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Packaging Equipment market by product type, application, key manufacturers and key regions and countries.

Market Segmentation:

Segmentation by type
Chip Bonding Equipment
Inspection and Cutting Equipment
Packaging equipment
Wire bonding equipment
Electroplating equipment
Other

Segmentation by application
Manufacturer of Integrated Devices
Packaged Semiconductor Assembly

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Applied Materials
ASM Pacific Technology
Kulicke and Soffa Industries
Tokyo Electron Limited
Tokyo Seimitsu
ChipMos
Greatek
Hua Hong
Jiangsu Changjiang Electronics Technology
Lingsen Precision
Nepes
Tianshui Huatian
Unisem
Veeco/CNT

Key Questions Addressed in this Report

What is the 10-year outlook for the global Semiconductor Packaging Equipment market?

What factors are driving Semiconductor Packaging Equipment market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Semiconductor Packaging Equipment market opportunities vary by end market size?

How does Semiconductor Packaging Equipment break out type, application?

What are the influences of COVID-19 and Russia-Ukraine war?

Please note: The report will take approximately 2 business days to prepare and deliver.