Global Semiconductor Packaging and Assembly Equipment Market Growth 2023-2029

Global Semiconductor Packaging and Assembly Equipment Market Growth 2023-2029

For an integrated chip (IC) to function, it needs to be connected to the package or connected directly to the printed circuit. This involves dicing, wire bonding, and die bonding. This entire process is known as semiconductor packaging and assembly, which is the back-end process of chip formation.

LPI (LP Information)' newest research report, the “Semiconductor Packaging and Assembly Equipment Industry Forecast” looks at past sales and reviews total world Semiconductor Packaging and Assembly Equipment sales in 2022, providing a comprehensive analysis by region and market sector of projected Semiconductor Packaging and Assembly Equipment sales for 2023 through 2029. With Semiconductor Packaging and Assembly Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Packaging and Assembly Equipment industry.

This Insight Report provides a comprehensive analysis of the global Semiconductor Packaging and Assembly Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Packaging and Assembly Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global Semiconductor Packaging and Assembly Equipment market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Packaging and Assembly Equipment and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Packaging and Assembly Equipment.

The global Semiconductor Packaging and Assembly Equipment market size is projected to grow from US$ 2695.5 million in 2022 to US$ 4057.6 million in 2029; it is expected to grow at a CAGR of 4057.6 from 2023 to 2029.

The die-level packaging and assembly equipment segment to be the major revenue contributing segment in this market during the forecasted period.

This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Packaging and Assembly Equipment market by product type, application, key manufacturers and key regions and countries.

Market Segmentation:

Segmentation by type
Die- Level Packaging and Assembly Equipment
Wafer-Level Packaging and Assembly Equipment

Segmentation by application
IDM (Integrated Device Manufacturers)
OSAT (Outsourced Semiconductor Assembly and Test Companies)

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Applied Materials
ASMPT
DISCO Corporation
EV Group
Kulicke and Soffa Industries
TEL
Tokyo Seimitsu
Rudolph Technologies
SEMES
Suss Microtec
Veeco/CNT
Ulvac Technologies

Key Questions Addressed in this Report

What is the 10-year outlook for the global Semiconductor Packaging and Assembly Equipment market?

What factors are driving Semiconductor Packaging and Assembly Equipment market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Semiconductor Packaging and Assembly Equipment market opportunities vary by end market size?

How does Semiconductor Packaging and Assembly Equipment break out type, application?

What are the influences of COVID-19 and Russia-Ukraine war?

Please note: The report will take approximately 2 business days to prepare and deliver.