Global Semiconductor Outsourced Manufacturing Market Growth (Status and Outlook) 2024-2030

Global Semiconductor Outsourced Manufacturing Market Growth (Status and Outlook) 2024-2030

This report studies the Semiconductor Outsourced Manufacturing, include the wafer semiconductor fabrication (Foundry) and Assembly, Test, and Packaging (OSAT) .

The key players of Foundries are TSMC, GlobalFoundries, United Microelectronics Corporation (UMC), SMIC, Tower Semiconductor, PSMC, Hua Hong Semiconductor/HLMC, etc.

The key players of OSAT are ASE (SPIL), Amkor, JCET (STATS ChipPAC), Tongfu Microelectronics (TFME), Powertech Technology Inc. (PTI), Carsem, etc.

The global Semiconductor Outsourced Manufacturing market size is projected to grow from US$ 199680 million in 2024 to US$ 290410 million in 2030; it is expected to grow at a CAGR of 6.4% from 2024 to 2030.

LPI (LP Information)' newest research report, the “Semiconductor Outsourced Manufacturing Industry Forecast” looks at past sales and reviews total world Semiconductor Outsourced Manufacturing sales in 2022, providing a comprehensive analysis by region and market sector of projected Semiconductor Outsourced Manufacturing sales for 2023 through 2029. With Semiconductor Outsourced Manufacturing sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Outsourced Manufacturing industry.

This Insight Report provides a comprehensive analysis of the global Semiconductor Outsourced Manufacturing landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Semiconductor Outsourced Manufacturing portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Outsourced Manufacturing market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Outsourced Manufacturing and breaks down the forecast by Type, by Business Model, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Outsourced Manufacturing.

United States market for Semiconductor Outsourced Manufacturing is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.

China market for Semiconductor Outsourced Manufacturing is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.

Europe market for Semiconductor Outsourced Manufacturing is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.

Global key Semiconductor Outsourced Manufacturing players cover TSMC, GlobalFoundries, United Microelectronics Corporation (UMC), SMIC, Tower Semiconductor, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2023.

This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Outsourced Manufacturing market by product type, application, key players and key regions and countries.

Segmentation by Type:
Analog ICs
Logic ICs
Micro IC (MCU and MPU)
Memory IC
Optoelectronics, Discretes, and Sensors

Segmentation by Business Model:
Foundries
Assembly, Test, and Packaging (OSAT)

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

Segmentation by Type:
Analog ICs
Logic ICs
Micro IC (MCU and MPU)
Memory IC
Optoelectronics, Discretes, and Sensors

Segmentation by Business Model:
Foundries
Assembly, Test, and Packaging (OSAT)

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
TSMC
GlobalFoundries
United Microelectronics Corporation (UMC)
SMIC
Tower Semiconductor
PSMC
VIS (Vanguard International Semiconductor)
Hua Hong Semiconductor
HLMC
X-FAB
DB HiTek
Nexchip
ASE (SPIL)
Amkor
JCET (STATS ChipPAC)
Tongfu Microelectronics (TFME)
Powertech Technology Inc. (PTI)
Carsem
King Yuan Electronics Corp. (KYEC)
KINGPAK Technology Inc
SFA Semicon
Unisem Group
Chipbond Technology Corporation
ChipMOS TECHNOLOGIES
OSE CORP.
Sigurd Microelectronics
Natronix Semiconductor Technology
Nepes
Forehope Electronic (Ningbo) Co.,Ltd.
Union Semiconductor（Hefei）Co., Ltd.
Hefei Chipmore Technology Co.,Ltd.
HT-tech
Chippacking
China Wafer Level CSP Co., Ltd
Ningbo ChipEx Semiconductor Co., Ltd
Guangdong Leadyo IC Testing
Unimos Microelectronics (Shanghai)
Sino Technology
Taiji Semiconductor (Suzhou)
Shanghai V-Test Semiconductor Tech
KESM Industries Berhad

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