Global Semiconductor Molding Systems Market Growth 2025-2031

Global Semiconductor Molding Systems Market Growth 2025-2031

The global Semiconductor Molding Systems market size is predicted to grow from US$ 437 million in 2025 to US$ 631 million in 2031; it is expected to grow at a CAGR of 6.3% from 2025 to 2031.

The semiconductor production process consists of wafer manufacturing, wafer testing, chip packaging and testing. Packaging refers to cutting, wire bonding, molding, trim & forming the wafer after production and processing, so that the integrated circuit can achieve electrical and signal connections with external devices while providing physical and chemical protection for the integrated circuit. Molding refers to a plastic molding process in which packaging materials such as epoxy resin mixture are injected into the mold cavity at a certain temperature and pressure, and the devices that need to be protected, such as chips, are wrapped in the plastic, and then solidified into a whole body. The roles of Molding products in semiconductor packaging are as follows: 1. Protective effect. Exposed semiconductor chips will not fail under strict environmental control, but the daily environment does not have the required environmental control conditions at all, so the chips need to be protected by packaging. 2. Supporting effect. The support has two functions. One is to support the chip, which is to fix the chip to facilitate circuit connection. The other is to form a certain shape to support the entire device after the packaging is completed, making the entire device less likely to be damaged. 3. Connection function. The function of the connection is to connect the electrodes of the chip to the external circuit, the pin is used to connect the external circuit, and the gold wire connects the pin to the circuit of the chip. The carrier stage is used to carry the chip, the epoxy resin adhesive is used to stick the chip on the carrier stage, the pins are used to support the entire device, and the plastic package plays a role in fixing and protecting it. 4. Ensure reliability. Any packaging needs to have a certain degree of reliability, which is the most important metric in the entire packaging process.

Gobal key players of Semiconductor Molding System market include Towa, Besi, ASMPT, I-PEX Inc, Tongling Trinity Technology, etc. The top five players hold a share about 88%. Asia-Pacific is the largest market, has a share about 82%, followed by North America, and Europe, with share 12% and 5%, separately. In terms of product type, Fully Automatic is the largest segment, occupied for a share of 64%. In terms of application, Advanced Packaging has a share about 51%.

LP Information, Inc. (LPI) ' newest research report, the “Semiconductor Molding Systems Industry Forecast” looks at past sales and reviews total world Semiconductor Molding Systems sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Molding Systems sales for 2025 through 2031. With Semiconductor Molding Systems sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Molding Systems industry.

This Insight Report provides a comprehensive analysis of the global Semiconductor Molding Systems landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Molding Systems portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Molding Systems market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Molding Systems and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Molding Systems.

This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Molding Systems market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Fully Automatic Molding System
Semi-automatic Molding System
Manual Molding System

Segmentation by Application:
Advanced Packaging
Traditional Packaging

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Towa
Besi
ASMPT
I-PEX Inc
Tongling Trinity Technology
Shanghai Xinsheng
Mtex Matsumura
Asahi Engineering
Nextool Technology Co., Ltd.
APIC YAMADA
Suzhou Bopai Semiconductor (Boschman)
Anhui Zhonghe

Key Questions Addressed in this Report

What is the 10-year outlook for the global Semiconductor Molding Systems market?

What factors are driving Semiconductor Molding Systems market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Semiconductor Molding Systems market opportunities vary by end market size?

How does Semiconductor Molding Systems break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.