Global Semiconductor Materials for CMP Market Growth (Status and Outlook) 2025-2031

The global Semiconductor Materials for CMP market size is predicted to grow from US$ 3839 million in 2025 to US$ 5749 million in 2031; it is expected to grow at a CAGR of 7.0% from 2025 to 2031.

Chemical Mechanical Planarization (CMP) is a critical process in semiconductor manufacturing used to smooth and planarize the surface of semiconductor wafers. This process combines both chemical and mechanical forces to remove material from the wafer surface, ensuring a flat and even surface necessary for subsequent photolithography and layer deposition steps in integrated circuit fabrication.

This report studies the semiconductor materials for CMP, include CMP Slurry, CMP Pads and CMP ancillaries (Pad-Conditioners, Filters, Rings, and Brushes).

CMP Pad is a product which increases semiconductor integration by smoothening the semiconductor wafer surface through physical and chemical polishing processes.

CMP slurries are abrasive materials, also called non-crystalline inorganic oxides, which are dispersed in water blended with other chemicals and used in CMP processes for semiconductors. CMP process is employed in semiconductor manufacturing, where surfaces of wafers are smoothed and leveled with the help of abrasive slurries. This process is critical for precise lithography patterning and is utilized after every deposition-etch step.

CMP ancillaries include CMP Pad Conditioners, CMP POU Slurry Filters, CMP PVA Brushes and CMP Retaining Rings.

CMP pad conditioners, are the chemical mechanical planarization regulator of a polishing pad, and are employed to condition a polishing pad to restore the pad planarity and surface roughness, which are specialized tools used in the semiconductor manufacturing process. They play a critical role in maintaining the performance and efficiency of CMP pads, which are used to polish wafers in the production of integrated circuits.

CMP Slurry Filters are designed to maximize many different semiconductor processes performance by controlling the size, and concentration of slurry particles. Cutting edge CMP filtration technologies lead to higher yields and less defects. By implementing industry leading filter designs, slurry particle size, and quantity of Large Particle Counts (LPCs) can be controlled to specified process parameters.

The semiconductor CMP materials has developed for several decades and displayed a high degree of market concentration. The market is dominated by few manufacturers from U.S. Europe, and Japan.

In terms of CMP slurry, the top eight players hold a share about 77 percent in 2023. After Acquisition of electronic Chemicals Business from Entegris, Fujifilm will be the largest manufacturer of CMP slurries. Other key players include Resonac, Fujimi Incorporated, DuPont, Merck KGaA (Versum Materials), AGC, KC Tech, and Anjimirco Shanghai, etc.

In terms of CMP pads, DuPont is the largest manufactuer, with a share over 66% in 2023, Other key players include Fujifilm (acquired Entegris electronic Chemicals Business), Fujibo Group, Hubei Dinglong, IVT Technologies Co, Ltd., etc.

Globa manufactuers of CMP Pad conditioners include 3M, Kinik Company, Saesol, and Entegris. The top five manufacturers occupied for nearly 90 percent of global market.

The CMP Slurry filters are dominated by few manufacturers, Entegris and Pall.

LPI (LP Information)' newest research report, the “Semiconductor Materials for CMP Industry Forecast” looks at past sales and reviews total world Semiconductor Materials for CMP sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Materials for CMP sales for 2025 through 2031. With Semiconductor Materials for CMP sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Materials for CMP industry.

This Insight Report provides a comprehensive analysis of the global Semiconductor Materials for CMP landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Semiconductor Materials for CMP portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Materials for CMP market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Materials for CMP and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Materials for CMP.

This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Materials for CMP market by product type, application, key players and key regions and countries.

Segmentation by Type:
CMP Slurry
CMP Pads
CMP Pad Conditioners
CMP POU Slurry Filters
CMP PVA Brushes
CMP Retaining Rings

Segmentation by Application:
300 Wafers
200 Wafers
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Fujifilm
Resonac
Fujimi Incorporated
DuPont
Merck KGaA (Versum Materials)
Fujifilm
AGC
KC Tech
JSR Corporation
Anjimirco Shanghai
Soulbrain
Saint-Gobain
Ace Nanochem
Dongjin Semichem
Vibrantz (Ferro)
WEC Group
SKC (SK Enpulse)
Shanghai Xinanna Electronic Technology
Hubei Dinglong
Beijing Hangtian Saide
Fujibo Group
3M
FNS TECH
IVT Technologies Co, Ltd.
TWI Incorporated
KPX Chemical
Engis Corporation
TOPPAN INFOMEDIA
Samsung SDI
Entegris
Pall
Cobetter
Kinik Company
Saesol Diamond
EHWA DIAMOND
Nippon Steel & Sumikin Materials
Shinhan Diamond
BEST Engineered Surface Technologies
Willbe S&T
CALITECH
Cnus Co., Ltd.
UIS Technologies
Euroshore
PTC, Inc.
AKT Components Sdn Bhd
Ensinger
CHUANYAN
Zhuhai Cornerstone Technologies
Konfoong Materials International
Tianjin Helen
Shenzhen Angshite Technology
Advanced Nano Products Co.,Ltd
Zhejiang Bolai Narun Electronic Materials
Xiamen Chia Ping Diamond Industrial

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