Global Semiconductor IC Design, Manufacturing, Packaging and Testing Market Growth (Status and Outlook) 2024-2030

Global Semiconductor IC Design, Manufacturing, Packaging and Testing Market Growth (Status and Outlook) 2024-2030

The semiconductor supply chain involves a complex network of companies, organizations, and individuals involved in the design, manufacturing, Semiconductor Test and Packaging, Semiconductor Equipment and Materials.

This report studies the semiconductor IC Design (IDM and fabless), IC Manufacturing (foundries and IDM), IC Packaging and IC Testing (OSAT and IDM).

Key IC design companies include NVIDIA, Qualcomm, Broadcom, Advanced Micro Devices, Inc. (AMD), MediaTek, Marvell Technology Group, Novatek Microelectronics Corp., Tsinghua Unigroup, Realtek Semiconductor Corporation and OmniVision Technology, Inc.

Key IC manufacturing/wafer fabrication companies are TSMC, Samsung Foundry, GlobalFoundries, United Microelectronics Corporation (UMC), SMIC, Tower Semiconductor, PSMC, VIS (Vanguard International Semiconductor), and Hua Hong Semiconductor, etc.

Key IDMs include Samsung, Intel, SK Hynix, Micron Technology, Texas Instruments (TI), STMicroelectronics, Kioxia, Sony Semiconductor Solutions Corporation (SSS), Infineon, NXP, Analog Devices, Inc. (ADI), Renesas Electronics, Microchip Technology and Onsemi, etc.

Key Assembly, Test, and Packaging (OSAT) companies include ASE (SPIL), Amkor, JCET (STATS ChipPAC), Tongfu Microelectronics (TFME), Powertech Technology Inc. (PTI), HT-tech, King Yuan Electronics Corp. (KYEC), ChipMOS TECHNOLOGIES and Chipbond Technology, etc.

The global Semiconductor IC Design, Manufacturing, Packaging and Testing market size is projected to grow from US$ 817430 million in 2024 to US$ 1132310 million in 2030; it is expected to grow at a CAGR of 5.6% from 2024 to 2030.

LPI (LP Information)' newest research report, the “Semiconductor IC Design, Manufacturing, Packaging and Testing Industry Forecast” looks at past sales and reviews total world Semiconductor IC Design, Manufacturing, Packaging and Testing sales in 2022, providing a comprehensive analysis by region and market sector of projected Semiconductor IC Design, Manufacturing, Packaging and Testing sales for 2023 through 2029. With Semiconductor IC Design, Manufacturing, Packaging and Testing sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor IC Design, Manufacturing, Packaging and Testing industry.

This Insight Report provides a comprehensive analysis of the global Semiconductor IC Design, Manufacturing, Packaging and Testing landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Semiconductor IC Design, Manufacturing, Packaging and Testing portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor IC Design, Manufacturing, Packaging and Testing market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor IC Design, Manufacturing, Packaging and Testing and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor IC Design, Manufacturing, Packaging and Testing.

United States market for Semiconductor IC Design, Manufacturing, Packaging and Testing is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.

China market for Semiconductor IC Design, Manufacturing, Packaging and Testing is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.

Europe market for Semiconductor IC Design, Manufacturing, Packaging and Testing is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.

Global key Semiconductor IC Design, Manufacturing, Packaging and Testing players cover Samsung-Memory, Intel, SK Hynix, Micron Technology, Texas Instruments (TI), etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2023.

This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor IC Design, Manufacturing, Packaging and Testing market by product type, application, key players and key regions and countries.

Segmentation by Type:
IC Design
IC Manufacturing
IC Packaging & Testing

Segmentation by Application:
Communication
Computer/PC
Consumer
Automotive
Industrial
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

Segmentation by Type:
IC Design
IC Manufacturing
IC Packaging & Testing

Segmentation by Application:
Communication
Computer/PC
Consumer
Automotive
Industrial
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Samsung-Memory
Intel
SK Hynix
Micron Technology
Texas Instruments (TI)
STMicroelectronics
Kioxia
Sony Semiconductor Solutions Corporation (SSS)
Infineon
NXP
Analog Devices, Inc. (ADI)
Renesas Electronics
Microchip Technology
Onsemi
NVIDIA
Qualcomm
Broadcom
Advanced Micro Devices, Inc. (AMD)
MediaTek
Marvell Technology Group
Novatek Microelectronics Corp.
Tsinghua Unigroup
Realtek Semiconductor Corporation
OmniVision Technology, Inc
Monolithic Power Systems, Inc. (MPS)
Cirrus Logic, Inc.
Socionext Inc.
LX Semicon
HiSilicon Technologies
TSMC
Samsung Foundry
GlobalFoundries
United Microelectronics Corporation (UMC)
SMIC
Tower Semiconductor
PSMC
VIS (Vanguard International Semiconductor)
Hua Hong Semiconductor
HLMC
ASE (SPIL)
Amkor
JCET (STATS ChipPAC)
Tongfu Microelectronics (TFME)
Powertech Technology Inc. (PTI)
HT-tech
King Yuan Electronics Corp. (KYEC)
ChipMOS TECHNOLOGIES
SFA Semicon
Chipbond Technology Corporation
UTAC
ASML
TEL (Tokyo Electron Ltd.)
Lam Research
KLA
Nikon
Carsem
SFA Semicon
Forehope Electronic (Ningbo) Co.,Ltd.
Unisem Group
OSE CORP.

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