Global Semiconductor Die Expander Market Growth 2024-2030

Global Semiconductor Die Expander Market Growth 2024-2030


Die-Matrix Expander is also called wafer expander. The wafer after dicing is expanded to increase the gap between independent dies, which is easy to be picked up and packed. After the stealth dicing, the modified layer inside the wafer is stretched by lifting and expanding actions, so that the wafer cracks along the modified layer, forming neat and controllable dicing cracks.

The global Semiconductor Die Expander market size is projected to grow from US$ 109 million in 2024 to US$ 168 million in 2030; it is expected to grow at a CAGR of 7.4% from 2024 to 2030.

LP Information, Inc. (LPI) ' newest research report, the “Semiconductor Die Expander Industry Forecast” looks at past sales and reviews total world Semiconductor Die Expander sales in 2023, providing a comprehensive analysis by region and market sector of projected Semiconductor Die Expander sales for 2024 through 2030. With Semiconductor Die Expander sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Die Expander industry.

This Insight Report provides a comprehensive analysis of the global Semiconductor Die Expander landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Die Expander portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Die Expander market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Die Expander and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Die Expander.

United States market for Semiconductor Die Expander is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.

China market for Semiconductor Die Expander is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.

Europe market for Semiconductor Die Expander is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.

Global key Semiconductor Die Expander players cover DISCO, Ohmiya Industry, Dynatex International, Techvision, N-TEC Corp., etc. In terms of revenue, the global two largest companies occupied for a share nearly

% in 2023.

This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Die Expander market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Semi-Automatic
Fully Automatic

Segmentation by Application:
6 & 8 Inch Wafer
12 Inch Wafer

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
DISCO
Ohmiya Industry
Dynatex International
Techvision
N-TEC Corp.
Semiconductor Equipment Corp
Toyo Adtec
Ultron Systems
Powatec
NeonTech
CHN.GIE

Key Questions Addressed in this Report

What is the 10-year outlook for the global Semiconductor Die Expander market?

What factors are driving Semiconductor Die Expander market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Semiconductor Die Expander market opportunities vary by end market size?

How does Semiconductor Die Expander break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.


*This is a tentative TOC and the final deliverable is subject to change.*
1 Scope of the Report
2 Executive Summary
3 Global by Company
4 World Historic Review for Semiconductor Die Expander by Geographic Region
5 Americas
6 APAC
7 Europe
8 Middle East & Africa
9 Market Drivers, Challenges and Trends
10 Manufacturing Cost Structure Analysis
11 Marketing, Distributors and Customer
12 World Forecast Review for Semiconductor Die Expander by Geographic Region
13 Key Players Analysis
14 Research Findings and Conclusion

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