Global Semiconductor CMP Polishing Pad Market Growth 2025-2031

The global Semiconductor CMP Polishing Pad market size is predicted to grow from US$ 1102 million in 2025 to US$ 1692 million in 2031; it is expected to grow at a CAGR of 7.4% from 2025 to 2031.

Chemical Mechanical Polishing (CMP), a key technology in the integrated circuit manufacturing process, uses both chemical erosion and mechanical force to planarize single-crystal silicon wafers and metal interconnect layers during processing. The semiconductor CMP polishing pad, also known as the chemical mechanical polishing pad, is a critical core material used in the chemical mechanical polishing process. It primarily serves to store the polishing slurry and distribute it evenly across the entire working area of the wafer, ensuring uniform polishing, removing residues generated during the polishing process, transmitting the mechanical energy required for material removal, and maintaining the necessary mechanical and chemical environment throughout the polishing process.

In the CMP process, the selection and use of the polishing pad are crucial for ensuring product quality and improving production efficiency. The appropriate polishing pad must be chosen based on various factors such as the type of silicon wafer material, the size and shape of the abrasive particles, the composition and application method of the polishing slurry, and other parameters. Strict control over these parameters during the polishing process is essential to achieve optimal polishing results.

The CMP polishing pad is an indispensable material in semiconductor manufacturing, and its performance directly affects the quality of the wafer surface. By selecting the appropriate polishing pad and strictly controlling the parameters during the polishing process, high-quality wafer surfaces can be ensured.

Currently, considering cost factors and the impact of silicon wafer size on the performance and efficiency of integrated circuits, the trend towards larger wafer sizes has become an inevitable and mainstream direction. Especially for 8-inch and 12-inch products, there is a possibility of moving towards 18-inch wafers in the future. However, as the size increases, so does the difficulty in producing corresponding CMP pads. As the trend towards larger downstream sizes becomes inevitable, to capture the market, it will be necessary to develop large-sized polishing pads; otherwise, one risks being phased out by the market. With the increasing expectations for superior performance of integrated circuits, the polishing performance of CMP pads must also improve. Therefore, more stringent requirements will be placed on their performance in the future.

From a consumer perspective, South Korea is currently the largest global consumer market, accounting for 23.52% of market revenue share in 2023, followed by mainland China and Taiwan, with shares of 21.71% and 19.02%, respectively. It is projected that China will experience the fastest growth over the next few years, with a CAGR of 9.30% from 2024 to 2030. In the coming years, China may reduce its import volume and rely more on domestic suppliers, although these companies may find it difficult to export. Given that the major consumption regions already have leading global enterprises, Europe might be the first region where Chinese companies can break through. Therefore, in the next few years, domestic Chinese enterprises' products will primarily focus on the domestic market. Additionally, due to current trade frictions and international political factors, this period could be the best opportunity for domestic CMP polishing pad manufacturers to capture the market, with national policy support expected to increase significantly in the coming years. Thus, the next few years present a significant localization opportunity for Chinese enterprises. We predict that Hubei Dinglong Holding Co., Ltd. might proactively lower product prices to aggressively capture market share.

In terms of producers, globally, key vendors of CMP polishing pads include DuPont, Entegris, Hubei Dinglong, Fujibo, and IVT Technologies, among others. In 2023, the top-tier vendors, mainly DuPont and Entegris, accounted for 76% of the market's revenue share; second-tier vendors, including Hubei Dinglong, Fujibo, and others, collectively held 15.84% of the revenue share. The CMP (Chemical Mechanical Polishing) polishing pad industry is currently in a stage of continuous growth, primarily driven by the demand for higher performance and smaller node sizes in semiconductor manufacturing. CMP polishing pads play a critical role in ensuring the precise flatness of the semiconductor wafer surface, especially in advanced node technologies (such as 7nm and 5nm processes), which require even stricter polishing standards. As a foundational, pioneering, and strategic pillar industry crucial to the national economy and social development, the semiconductor industry receives strong support from national and local policies. Among these, the substantial need for localization of core process materials in the semiconductor industry has become a widely recognized consensus, presenting a favorable situation of rapid growth. The dependence on imported semiconductor materials in China is quite high, making the demand for import substitution urgent. Under the combined influence of market demand, technological advancements, and policy incentives, domestic semiconductor material enterprises are showing an accelerated growth trend, with vast potential for development.

Currently, none of the several marketized companies in China have obtained foreign certifications, thus they do not export. Since the main downstream enterprises are concentrated in Japan, Taiwan, South Korea, and Europe and America, and given that, apart from Europe and South Korea, the other regions have significant market positions for their local CMP polishing pad enterprises, domestic Chinese enterprises' products will primarily target the domestic market in the next few years.

LP Information, Inc. (LPI) ' newest research report, the “Semiconductor CMP Polishing Pad Industry Forecast” looks at past sales and reviews total world Semiconductor CMP Polishing Pad sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor CMP Polishing Pad sales for 2025 through 2031. With Semiconductor CMP Polishing Pad sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor CMP Polishing Pad industry.

This Insight Report provides a comprehensive analysis of the global Semiconductor CMP Polishing Pad landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor CMP Polishing Pad portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor CMP Polishing Pad market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor CMP Polishing Pad and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor CMP Polishing Pad.

This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor CMP Polishing Pad market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Polymer CMP Pad
Non-woven CMP Pad
Composite CMP Pad

Segmentation by Application:
300 mm Wafer
200 mm Wafer
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
DuPont
Entegris
Hubei Dinglong
Fujibo
IVT Technologies
SK enpulse
KPX Chemical
TWI Incorporated
3M
FNS TECH

Key Questions Addressed in this Report

What is the 10-year outlook for the global Semiconductor CMP Polishing Pad market?

What factors are driving Semiconductor CMP Polishing Pad market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Semiconductor CMP Polishing Pad market opportunities vary by end market size?

How does Semiconductor CMP Polishing Pad break out by Type, by Application?

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