Global Semiconductor Back-End Equipment Market Growth 2025-2031

The global Semiconductor Back-End Equipment market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR of %from 2025 to 2031.

According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.

LP Information, Inc. (LPI) ' newest research report, the “Semiconductor Back-End Equipment Industry Forecast” looks at past sales and reviews total world Semiconductor Back-End Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Back-End Equipment sales for 2025 through 2031. With Semiconductor Back-End Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Back-End Equipment industry.

This Insight Report provides a comprehensive analysis of the global Semiconductor Back-End Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Back-End Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Back-End Equipment market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Back-End Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Back-End Equipment.

This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Back-End Equipment market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Wafer Inspection Equipment
Dicing Equipment
Bonding Equipment
Molding Equipment
Encapsulation Equipment
Others

Segmentation by Application:
Integrated Device Manufacturer (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
ASML
KLA
Lam Research
Tokyo Electron
Advantest
Onto Innovation
SCREEN
Teradyne
Matsusada Precision
ADVANCED Motion Controls
SFA Semiconductor
Applied Materials
Hitachi High-Technologies
Toray Engineering
Lasertec
Cohu
Techwing
DISCO
TOKYO SEIMITSU
GL Tech
Synova
Besi
Kulicke & Soffa
Palomar
DIAS Automation
Semes
Fasford
Yamaha Robotics Holdings
TOWA
ASMPT
I-PEX

Key Questions Addressed in this Report

What is the 10-year outlook for the global Semiconductor Back-End Equipment market?

What factors are driving Semiconductor Back-End Equipment market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Semiconductor Back-End Equipment market opportunities vary by end market size?

How does Semiconductor Back-End Equipment break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.