Global Semiconductor Assembly and Packaging Services Market Growth (Status and Outlook) 2023-2029

Global Semiconductor Assembly and Packaging Services Market Growth (Status and Outlook) 2023-2029

Semiconductor assembly and packaging services are crucial in the semiconductor production process. The package of the semiconductor device is usually made of materials such as plastic, metal, and ceramic/glass. Packaging is undertaken to provide protection against impact and corrosion.

LPI (LP Information)' newest research report, the “Semiconductor Assembly and Packaging Services Industry Forecast” looks at past sales and reviews total world Semiconductor Assembly and Packaging Services sales in 2022, providing a comprehensive analysis by region and market sector of projected Semiconductor Assembly and Packaging Services sales for 2023 through 2029. With Semiconductor Assembly and Packaging Services sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Assembly and Packaging Services industry.

This Insight Report provides a comprehensive analysis of the global Semiconductor Assembly and Packaging Services landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Assembly and Packaging Services portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Assembly and Packaging Services market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Assembly and Packaging Services and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Assembly and Packaging Services.

The global Semiconductor Assembly and Packaging Services market size is projected to grow from US$ 6279.7 million in 2022 to US$ 8411.4 million in 2029; it is expected to grow at a CAGR of 4.3% from 2023 to 2029.

The communication sector accounted for the largest share of the semiconductor assembly and packaging services market during 2017. According to Technavio’s market research analysts, this segment is likely to continue its dominance in the wafer fabrication market throughout the forecast period.

This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Assembly and Packaging Services market by product type, application, key players and key regions and countries.

Market Segmentation:

Segmentation by type
Assembly Services
Packaging Services

Segmentation by application
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
Other

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Advanced Semiconductor Engineering (ASE)
Amkor Technology
Intel
Samsung Electronics
SPIL
TSMC

Please note: The report will take approximately 2 business days to prepare and deliver.