Global Semiconductor Assembly and Packaging Equipment Market Growth (Status and Outlook) 2023-2029

Global Semiconductor Assembly and Packaging Equipment Market Growth (Status and Outlook) 2023-2029

Semiconductor Assembly and Packaging Equipment is used for an integrated chip to function, it needs to be connected to the package or directly to the printed circuit. This involves wire bonding, die-bonding, and dicing. Also, it is a back end process of chip formation. Semiconductor chip assembly is also a key component of the semiconductor supply chain.

LPI (LP Information)' newest research report, the “Semiconductor Assembly and Packaging Equipment Industry Forecast” looks at past sales and reviews total world Semiconductor Assembly and Packaging Equipment sales in 2022, providing a comprehensive analysis by region and market sector of projected Semiconductor Assembly and Packaging Equipment sales for 2023 through 2029. With Semiconductor Assembly and Packaging Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Assembly and Packaging Equipment industry.

This Insight Report provides a comprehensive analysis of the global Semiconductor Assembly and Packaging Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Assembly and Packaging Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Assembly and Packaging Equipment market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Assembly and Packaging Equipment and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Assembly and Packaging Equipment.

The global Semiconductor Assembly and Packaging Equipment market size is projected to grow from US$ million in 2022 to US$ million in 2029; it is expected to grow at a CAGR of % from 2023 to 2029.

United States market for Semiconductor Assembly and Packaging Equipment is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.

China market for Semiconductor Assembly and Packaging Equipment is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.

Europe market for Semiconductor Assembly and Packaging Equipment is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.

Global key Semiconductor Assembly and Packaging Equipment players cover Advantest, Accrutech, Shinkawa, KLA-Tencor, Teradyne Inc., Amkor Technology, Tokyo Electron Limited, Lam Research Corporation and ASML Holding N.V, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2022.

This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Assembly and Packaging Equipment market by product type, application, key players and key regions and countries.

Market Segmentation:

Segmentation by type
Electroplating Equipment
Inspection and Cutting Equipment
Lead Bonding Equipment
Chip Bonding Equipment
Others

Segmentation by application
Automotive
Enterprise Storage
Consumer Electronics
Healthcare Devices
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Advantest
Accrutech
Shinkawa
KLA-Tencor
Teradyne Inc.
Amkor Technology
Tokyo Electron Limited
Lam Research Corporation
ASML Holding N.V
Applied Materials
Toray Engineering
Kulicke & Soffa Industries
Hesse Mechatronics
Palomar Technologies
West Bond
DIAS Automation
Screen Holdings Co. Ltd
Hitachi High-Technologies Corporation
HYBONDASM Pacific Technology

Please note: The report will take approximately 2 business days to prepare and deliver.