Global Semiconductor Advanced Packaging Materials Market Growth (Status and Outlook) 2025-2031

The global Semiconductor Advanced Packaging Materials market size is predicted to grow from US$ 15320 million in 2025 to US$ 28010 million in 2031; it is expected to grow at a CAGR of 10.6% from 2025 to 2031.

Traditional semiconductor packaging materials mainly include packaging substrates, lead frames, bonding wires, ceramic packaging materials, chip bonding materials, etc. The packaging materials in the advanced packaging field (FC, WB, WLCSP, etc.) are mainly packaging substrates (ABF), underfill, die attach materials (paste and wire), epoxy molding compounds, etc.

United States market for Semiconductor Advanced Packaging Materials is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

China market for Semiconductor Advanced Packaging Materials is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Europe market for Semiconductor Advanced Packaging Materials is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Global key Semiconductor Advanced Packaging Materials players cover Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.

LPI (LP Information)' newest research report, the “Semiconductor Advanced Packaging Materials Industry Forecast” looks at past sales and reviews total world Semiconductor Advanced Packaging Materials sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Advanced Packaging Materials sales for 2025 through 2031. With Semiconductor Advanced Packaging Materials sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Advanced Packaging Materials industry.

This Insight Report provides a comprehensive analysis of the global Semiconductor Advanced Packaging Materials landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Semiconductor Advanced Packaging Materials portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Advanced Packaging Materials market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Advanced Packaging Materials and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Advanced Packaging Materials.

This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Advanced Packaging Materials market by product type, application, key players and key regions and countries.

Segmentation by Type:
FC Package Substrate (FC-CSP and ABF)
WB Package Substrate (WB-BGA)
Underfill
Die Attach Material (Paste and Wire)
Epoxy Molding Compound
Others

Segmentation by Application:
Consumer Electronics
Automotive
IoT
5G
High Performance Computing
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Unimicron
Ibiden
Nan Ya PCB
Shinko Electric Industries
Kinsus Interconnect
AT&S
Semco
Kyocera
TOPPAN
Zhen Ding Technology
Daeduck Electronics
Zhuhai Access Semiconductor
LG InnoTek
Shennan Circuit
Shenzhen Fastprint Circuit Tech
Henkel
Won Chemical
NAMICS
Resonac
Panasonic
MacDermid Alpha
Shin-Etsu Chemical
Sunstar
Fuji Chemical
Zymet
Threebond
AIM Solder
LORD Corporation
SMIC Senju Metal Industry Co., Ltd
Shenmao Technology
Heraeu
Sumitomo Bakelite
Indium
Tamura
Shanghai Doitech
KCC
Eternal Materials
NAGASE
Hysol Huawei Electronics
Jiangsu HHCK Advanced Materials

Please note: The report will take approximately 2 business days to prepare and deliver.