Global Semiconductor Advanced Packaging Market Growth (Status and Outlook) 2023-2029

Global Semiconductor Advanced Packaging Market Growth (Status and Outlook) 2023-2029

Advanced packaging is a general grouping of a variety of distinct techniques, including 2.5D, 3D-IC, fan-out wafer-level packaging and system-in-package, etc.

LPI (LP Information)' newest research report, the “Semiconductor Advanced Packaging Industry Forecast” looks at past sales and reviews total world Semiconductor Advanced Packaging sales in 2022, providing a comprehensive analysis by region and market sector of projected Semiconductor Advanced Packaging sales for 2023 through 2029. With Semiconductor Advanced Packaging sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Advanced Packaging industry.

This Insight Report provides a comprehensive analysis of the global Semiconductor Advanced Packaging landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Advanced Packaging portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Advanced Packaging market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Advanced Packaging and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Advanced Packaging.

The global Semiconductor Advanced Packaging market size is projected to grow from US$ 15330 million in 2022 to US$ 25900 million in 2029; it is expected to grow at a CAGR of 7.8% from 2023 to 2029.

Top 5 manufacturers accounted for 43.06% market share in 2019.

This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Advanced Packaging market by product type, application, key players and key regions and countries.

Market Segmentation:

Segmentation by type
Fan-Out Wafer-Level Packaging (FO WLP)
Fan-In Wafer-Level Packaging (FI WLP)
Flip Chip (FC)
2.5D/3D

Segmentation by application
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
Other

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Advanced Semiconductor Engineering (ASE)
Amkor Technology
Samsung
TSMC (Taiwan Semiconductor Manufacturing Company)
China Wafer Level CSP
ChipMOS Technologies
FlipChip International
HANA Micron
Interconnect Systems (Molex)
Jiangsu Changjiang Electronics Technology (JCET)
King Yuan Electronics
Tongfu Microelectronics
Nepes
Powertech Technology (PTI)
Signetics
Tianshui Huatian
Veeco/CNT
UTAC Group

Please note: The report will take approximately 2 business days to prepare and deliver.