Global Semiconductor Advanced Packaging Equipment Market Growth 2025-2031

The global Semiconductor Advanced Packaging Equipment market size is predicted to grow from US$ 50260 million in 2025 to US$ 76980 million in 2031; it is expected to grow at a CAGR of 7.4% from 2025 to 2031.

As a key link in the semiconductor industry, the diversity and complexity of advanced packaging technology are reflected in a variety of classification standards, among which whether it includes wire bonding process or photolithography process has become an important way to distinguish.

As the foundation of the semiconductor packaging field, the main feature of traditional packaging technology is that it does not involve photolithography, a high-precision, multi-step process. In this technical path, the cut wafer is precisely connected between the solder joints on the chip and the lead frame through the wire bonding process, that is, extremely fine metal wires (usually gold or copper wires) are connected by hot pressing or ultrasonic welding. The electrical connection between the internal circuit of the chip and the external package pins is realized.

In contrast, advanced packaging technology mainly relies on photolithography process. This high-precision technology makes it possible to realize key process technologies such as RDL (rewiring layer), Bumping (bumping) and TSV (through silicon via). The photolithography process is a complex and delicate process, which involves a series of steps such as glue coating, exposure, development, electroplating, degumming, and etching. First, a layer of photoresist is evenly coated on the surface of the wafer through the coating step; then, the photoresist is exposed through a mask with light of a specific wavelength to chemically change the photoresist in the exposed area; then, the photoresist in a specific area is removed or retained through the development step to form a fine pattern; on this basis, electroplating and other processes are used to deposit a metal layer to form the required electrical connection structure; then, the remaining photoresist is removed, and the structure is further refined through etching and other steps. This series of steps together constitutes the core of the photolithography process in advanced packaging technology, enabling more complex and higher-density packaging structures.

United States market for Semiconductor Advanced Packaging Equipment is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

China market for Semiconductor Advanced Packaging Equipment is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Europe market for Semiconductor Advanced Packaging Equipment is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Global key Semiconductor Advanced Packaging Equipment players cover Applied Materials, Lam Research, TEL, ULVAC, Samco Inc, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.

LP Information, Inc. (LPI) ' newest research report, the “Semiconductor Advanced Packaging Equipment Industry Forecast” looks at past sales and reviews total world Semiconductor Advanced Packaging Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Advanced Packaging Equipment sales for 2025 through 2031. With Semiconductor Advanced Packaging Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Advanced Packaging Equipment industry.

This Insight Report provides a comprehensive analysis of the global Semiconductor Advanced Packaging Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Advanced Packaging Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Advanced Packaging Equipment market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Advanced Packaging Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Advanced Packaging Equipment.

This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Advanced Packaging Equipment market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Cleaning
Deposition
Coater & Developer
Photolithography
Electroplating
Etching
Inspection
Others

Segmentation by Application:
FC
2.5D/3D
SiP
WLCSP
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Applied Materials
Lam Research
TEL
ULVAC
Samco Inc
ACM Research
KLA (SPTS)
SPP Technologies
GigaLane Co., Ltd
AMEC
NAURA
SCREEN Febax
Shibaura Mechatronics
Evatec AG
TAZMO
SUSS MicroTec
SMEE
Veeco
Onto Innovation
Canon
EV Group
ASMPT
TKC
Besi
TANAKA Precious Metals
RENA Technologies
Camtek
Intekplus
Cohu
KINGSEMI Co., Ltd
Jiangsu Alpha Semiconductor
Systech Semiconductor
Suzhou Zhicheng Semiconductor
Pnc Process Systems Co.,Ltd
Lasertec
TAKAOKA TOKO
CORTEX ROBOTICS
Confovis
Parmi Corp
Test Research, Inc

Key Questions Addressed in this Report

What is the 10-year outlook for the global Semiconductor Advanced Packaging Equipment market?

What factors are driving Semiconductor Advanced Packaging Equipment market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Semiconductor Advanced Packaging Equipment market opportunities vary by end market size?

How does Semiconductor Advanced Packaging Equipment break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.