Global Reflow Oven for PCB and Semiconductor Market Growth 2025-2031

Global Reflow Oven for PCB and Semiconductor Market Growth 2025-2031

The global Reflow Oven for PCB and Semiconductor market size is predicted to grow from US$ 381 million in 2025 to US$ 490 million in 2031; it is expected to grow at a CAGR of 4.3% from 2025 to 2031.

Reflow Oven is a machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards (PCB). Reflow soldering is the most common method of attaching surface mount components to a circuit board.

Global key reflow oven for PCB and semiconductor players include Shenzhen JT Automation, Folungwin and Heller Industries etc. The top 3 companies hold a share about 30%. Asia-Pacific is the largest market with a share about 78% followed by North America and Europe.

In terms of product, convection product is the largest segment with a share about 83%. And in terms of applications, the largest application is telecommunication with a share about 36%.

LP Information, Inc. (LPI) ' newest research report, the “Reflow Oven for PCB and Semiconductor Industry Forecast” looks at past sales and reviews total world Reflow Oven for PCB and Semiconductor sales in 2024, providing a comprehensive analysis by region and market sector of projected Reflow Oven for PCB and Semiconductor sales for 2025 through 2031. With Reflow Oven for PCB and Semiconductor sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Reflow Oven for PCB and Semiconductor industry.

This Insight Report provides a comprehensive analysis of the global Reflow Oven for PCB and Semiconductor landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Reflow Oven for PCB and Semiconductor portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Reflow Oven for PCB and Semiconductor market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Reflow Oven for PCB and Semiconductor and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Reflow Oven for PCB and Semiconductor.

This report presents a comprehensive overview, market shares, and growth opportunities of Reflow Oven for PCB and Semiconductor market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Convection Reflow Oven
Vapour Phase Reflow Oven

Segmentation by Application:
Telecommunication
Consumer Electronics
Automotive
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Rehm Thermal Systems
Kurtz Ersa
BTU International
Heller Industries
Shenzhen JT Automation
TAMURA Corporation
ITW EAE
SMT Wertheim
Senju Metal Industry Co., Ltd
Folungwin
JUKI
SEHO Systems GmbH
Suneast
ETA
Papaw
EIGHTECH TECTRON

Key Questions Addressed in this Report

What is the 10-year outlook for the global Reflow Oven for PCB and Semiconductor market?

What factors are driving Reflow Oven for PCB and Semiconductor market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Reflow Oven for PCB and Semiconductor market opportunities vary by end market size?

How does Reflow Oven for PCB and Semiconductor break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.