Global Radiation-Hardened Electronics for Space Application Market Growth (Status and Outlook) 2024-2030

Global Radiation-Hardened Electronics for Space Application Market Growth (Status and Outlook) 2024-2030

According to this study, the global Radiation-Hardened Electronics for Space Application market size will reach US$ million by 2030.

This report presents a comprehensive overview, market shares, and growth opportunities of Radiation-Hardened Electronics for Space Application market by product type, application, key players and key regions and countries.

Segmentation by product type:
Silicon Material
Gallium Nitride Material
Silicon Carbide Material
Others

Segmentation by Application:
Satellite
Launch Vehicle
Deep Space Probe
Others

This report also splits the market by region:
United States
China
Europe
Other regions:
Japan
South Korea
Southeast Asia
Rest of world

The report also presents the market competition landscape and a corresponding detailed analysis of the major players in the market. The key players covered in this report:
3D Plus
Analog Devices, Inc.
Apogee Semiconductor
Cobham Plc
Data Device Corporation
Exxelia
General Dynamics
GSI Technology, Inc.
Infineon Technologies
Mercury Systems, Inc.
Microchip Technology, Inc.
Micropac Industries
Renesas Electronics Corporation
Solid State Devices, Inc.
STMicroelectronics N.V.
Teledyne Technologies
Texas Instruments
Vorago Technologies
Xilinx, Inc.

Please note: The report will take approximately 2 business days to prepare and deliver.