Global Quad-Flat-No-Lead Packaging (QFN) Market Growth 2025-2031

Global Quad-Flat-No-Lead Packaging (QFN) Market Growth 2025-2031

The global Quad-Flat-No-Lead Packaging (QFN) market size is predicted to grow from US$ 3775 million in 2025 to US$ 4249 million in 2031; it is expected to grow at a CAGR of 2.0% from 2025 to 2031.

Quad-Flat-No-Lead (QFN) packaging is a type of surface-mount integrated circuit (IC) package that provides a compact and low-profile solution for electronic components. It is widely used in various industries, including consumer electronics, telecommunications, automotive, and industrial applications.

QFN packages are designed to have no leads protruding from the sides. Instead, the electrical connections are made through metal pads on the bottom surface of the package. This design allows for a smaller package size and improved thermal and electrical performance compared to traditional leaded packages.

QFN packaging has gained popularity in the electronics industry due to its compact size, good thermal performance, and reliability. It enables the development of smaller and more powerful electronic devices while optimizing space utilization on PCBs.

Global key players of Quad-Flat-No-Lead Packaging(QFN) include ASE(SPIL), Amkor Technology, JCET Group, Powertech Technology Inc. and Tongfu Microelectronics, etc. Top five players occupy for a share about 70%. Asia-Pacific is the largest market, with a share about 77%, followed by Europe and North America. In terms of product, Sawn Type is the largest segment, with a share over 63%. In terms of Package Size, Above 5x5 to 7x7 is the largest market, with a share over 28%.

LP Information, Inc. (LPI) ' newest research report, the “Quad-Flat-No-Lead Packaging (QFN) Industry Forecast” looks at past sales and reviews total world Quad-Flat-No-Lead Packaging (QFN) sales in 2024, providing a comprehensive analysis by region and market sector of projected Quad-Flat-No-Lead Packaging (QFN) sales for 2025 through 2031. With Quad-Flat-No-Lead Packaging (QFN) sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Quad-Flat-No-Lead Packaging (QFN) industry.

This Insight Report provides a comprehensive analysis of the global Quad-Flat-No-Lead Packaging (QFN) landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Quad-Flat-No-Lead Packaging (QFN) portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Quad-Flat-No-Lead Packaging (QFN) market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Quad-Flat-No-Lead Packaging (QFN) and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Quad-Flat-No-Lead Packaging (QFN).

This report presents a comprehensive overview, market shares, and growth opportunities of Quad-Flat-No-Lead Packaging (QFN) market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Punched Type
Sawn Type

Segmentation by Application:
Automotive
Consumer Electronics
Industrial
Communications
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
ASE(SPIL)
Amkor Technology
JCET Group
Powertech Technology Inc.
Tongfu Microelectronics
Tianshui Huatian Technology
UTAC
Orient Semiconductor
ChipMOS
King Yuan Electronics
SFA Semicon

Key Questions Addressed in this Report

What is the 10-year outlook for the global Quad-Flat-No-Lead Packaging (QFN) market?

What factors are driving Quad-Flat-No-Lead Packaging (QFN) market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Quad-Flat-No-Lead Packaging (QFN) market opportunities vary by end market size?

How does Quad-Flat-No-Lead Packaging (QFN) break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.