Global Power Electronic DCB & AMB Substrates Market Growth 2024-2030

Global Power Electronic DCB & AMB Substrates Market Growth 2024-2030

DBC (Direct Bonded Copper) substrates are composed of a ceramic insulator, Al2O3 or AlN onto which pure copper metal is attached by a high temperature eutectic melting process and thus tightly and firmly joined to the ceramic. This report studies the DBC ceramic substrate, including the AlN DBC Ceramic Substrate and Al2O3 DBC Ceramic Substrate. Active Metal Brazing (AMB) is the latest developments in ceramic substrates and offers the ability to produce Heavy Copper with a AlN (Aluminium Nitride) or SiN (Silicon Nitride). The normal metallisation process is not used as AMB involves brazing pure copper on the ceramic in a high temperature vacuum brazing process. As well as offering a high reliability substrate with unique heat dissipation. The brazing technology also enables double sided copper weights of up to 800µm on thin ceramic substrates of just 0.25mm.

The global Power Electronic DCB & AMB Substrates market size is projected to grow from US$ 1237 million in 2024 to US$ 3343 million in 2030; it is expected to grow at a CAGR of 18.0% from 2024 to 2030.

LP Information, Inc. (LPI) ' newest research report, the “Power Electronic DCB & AMB Substrates Industry Forecast” looks at past sales and reviews total world Power Electronic DCB & AMB Substrates sales in 2023, providing a comprehensive analysis by region and market sector of projected Power Electronic DCB & AMB Substrates sales for 2024 through 2030. With Power Electronic DCB & AMB Substrates sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Power Electronic DCB & AMB Substrates industry.

This Insight Report provides a comprehensive analysis of the global Power Electronic DCB & AMB Substrates landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Power Electronic DCB & AMB Substrates portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Power Electronic DCB & AMB Substrates market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Power Electronic DCB & AMB Substrates and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Power Electronic DCB & AMB Substrates.

Global key players of Power Electronic DCB & AMB Substrates include Rogers Corporation, Ferrotec, BYD, etc. The top three players hold a share over 56%. Asia Pacific is the largest market, with a share about 62%. In terms of product type, DBC Ceramic Substrates is the largest segment, occupied for a share of 51%. In terms of application, Automotive & EV/HEV is the largest, which has a share about 57 percent.

This report presents a comprehensive overview, market shares, and growth opportunities of Power Electronic DCB & AMB Substrates market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
DBC Ceramic Substrates
AMB Ceramic Substrate

Segmentation by Application:
Automotive & EV/HEV
PV and Wind Power
Industrial Drives
Rail Transport
Consumer & White Goods
Military & Avionics
Thermoelectric Module (TEM)
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Rogers
NGK Electronics Devices
Heraeus Electronics
Jiangsu Fulehua Semiconductor Technology
Toshiba Materials
Denka
Proterial
Mitsubishi Materials
Kyocera
DOWA METALTECH
FJ Composite
KCC
Stellar Industries Corp
Littelfuse IXYS
Remtec
Shengda Tech
Nanjing Zhongjiang New Material Science & Technology
BYD
Zibo Linzi Yinhe High-Tech Development
Chengdu Wanshida Ceramic Industry
Zhejiang TC Ceramic Electronic
Tong Hsing (acquired HCS)
Fujian Huaqing Electronic Material Technology
Zhejiang Jingci Semiconductor
Konfoong Materials International
Taotao Technology
Anhui Taoxinke Semiconductor
Guangde Dongfeng Semiconductor
Beijing Moshi Technology
Nantong Winspower
Wuxi Tianyang Electronics

Key Questions Addressed in this Report

What is the 10-year outlook for the global Power Electronic DCB & AMB Substrates market?

What factors are driving Power Electronic DCB & AMB Substrates market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Power Electronic DCB & AMB Substrates market opportunities vary by end market size?

How does Power Electronic DCB & AMB Substrates break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.