Global Power Discrete and Modules Design Market Growth (Status and Outlook) 2024-2030

Global Power Discrete and Modules Design Market Growth (Status and Outlook) 2024-2030

The semiconductor discrete device industry chain mainly includes three major processes: chip design, chip manufacturing, and packaging and testing. According to the different business models involved, the business model is divided into two types: IDM and foundry. Currently IDMs are dominating the discrete semiconductor market.

This report studies the discrete power semiconductors and modules design, include IGBTs design, MOSFETs design, FRD design, TVS design, BJT design, SiC devices design etc. According to business models, this market includes IDMs and Fabless.

The key IDMs are Infineon, STMicroelectronics, Wolfspeed, Rohm, onsemi, Microchip (Microsemi), Mitsubishi Electric and Fuji Electric, etc.

The representative fabless include of power discretes Semtech, Niko Semiconductor, OmniVision Technologies, MacMic Science & Technolog, and BASiC Semiconductor, Navitas (GeneSiC), UnitedSiC, SemiQ, PN Junction Semiconductor (Hangzhou), and Cissoid, etc.

The global Power Discrete and Modules Design market size is projected to grow from US$ 36360 million in 2024 to US$ 49980 million in 2030; it is expected to grow at a CAGR of 5.4% from 2024 to 2030.

LPI (LP Information)' newest research report, the “Power Discrete and Modules Design Industry Forecast” looks at past sales and reviews total world Power Discrete and Modules Design sales in 2022, providing a comprehensive analysis by region and market sector of projected Power Discrete and Modules Design sales for 2023 through 2029. With Power Discrete and Modules Design sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Power Discrete and Modules Design industry.

This Insight Report provides a comprehensive analysis of the global Power Discrete and Modules Design landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Power Discrete and Modules Design portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Power Discrete and Modules Design market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Power Discrete and Modules Design and breaks down the forecast by Technology, by Business Model, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Power Discrete and Modules Design.

United States market for Power Discrete and Modules Design is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.

China market for Power Discrete and Modules Design is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.

Europe market for Power Discrete and Modules Design is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.

Global key Power Discrete and Modules Design players cover STMicroelectronics, Infineon, Wolfspeed, Rohm, onsemi, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2023.

This report presents a comprehensive overview, market shares, and growth opportunities of Power Discrete and Modules Design market by product type, application, key players and key regions and countries.

Segmentation by Technology:
Discrete IGBTs
IGBT Module
IPMs
Discrete Power MOSFETs
SIC MOSFET Module
Rectifiers
Power Diode
Others

Segmentation by Business Model:
IDM
Fabless

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

Segmentation by Technology:
Discrete IGBTs
IGBT Module
IPMs
Discrete Power MOSFETs
SIC MOSFET Module
Rectifiers
Power Diode
Others

Segmentation by Business Model:
IDM
Fabless

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
STMicroelectronics
Infineon
Wolfspeed
Rohm
onsemi
BYD Semiconductor
Microchip (Microsemi)
Mitsubishi Electric (Vincotech)
Semikron Danfoss
Fuji Electric
Navitas (GeneSiC)
Toshiba
Qorvo (UnitedSiC)
San'an Optoelectronics
Littelfuse (IXYS)
CETC 55
WeEn Semiconductors
BASiC Semiconductor
SemiQ
Diodes Incorporated
SanRex
Alpha & Omega Semiconductor
Bosch
GE Aerospace
KEC Corporation
PANJIT Group
Nexperia
Vishay Intertechnology
Zhuzhou CRRC Times Electric
China Resources Microelectronics Limited
StarPower
Renesas Electronics
Hitachi Power Semiconductor Device
Microchip
Sanken Electric
Semtech
MagnaChip
Texas Instruments
Unisonic Technologies (UTC)
Niko Semiconductor
NCEPOWER
Jiangsu Jiejie Microelectronics
OmniVision Technologies
Suzhou Good-Ark Electronics
MacMic Science & Technolog
Hubei TECH Semiconductors
Yangzhou Yangjie Electronic Technology
Guangdong AccoPower Semiconductor
Changzhou Galaxy Century Microelectronics
Hangzhou Silan Microelectronics
Cissoid
InventChip Technology
Hebei Sinopack Electronic Technology
Oriental Semiconductor
Jilin Sino-Microelectronics
PN Junction Semiconductor (Hangzhou)

Please note: The report will take approximately 2 business days to prepare and deliver.