Global Plating for Microelectronics Market Growth (Status and Outlook) 2023-2029

Global Plating for Microelectronics Market Growth (Status and Outlook) 2023-2029

Metal plating (also known as electroplating or electrodeposition) is a coating technology that deposits a thin later of a metal or alloy on a conductive surface to impart particular functional or aesthetic properties. During the plating process, the object to be plated functions as the positively charged cathode while the desired plating material serves as the negatively charged anode and source of the metallic ions that will form the final coating. Immersing both materials in a bath or solution of electrolyte salts and adding an electrical current causes an oxidation/reduction reaction on the surface of the cathode where the metallic ions are deposited.

There are numerous metals commonly used as plating materials such as zinc, copper, chromium, and nickel. which impart wear and corrosion resistance, improve strength, and enhance solderability. Precious metal coatings are especially important to the electronics and semiconductor industries.

LPI (LP Information)' newest research report, the “Plating for Microelectronics Industry Forecast” looks at past sales and reviews total world Plating for Microelectronics sales in 2022, providing a comprehensive analysis by region and market sector of projected Plating for Microelectronics sales for 2023 through 2029. With Plating for Microelectronics sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Plating for Microelectronics industry.

This Insight Report provides a comprehensive analysis of the global Plating for Microelectronics landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Plating for Microelectronics portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Plating for Microelectronics market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Plating for Microelectronics and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Plating for Microelectronics.

The global Plating for Microelectronics market size is projected to grow from US$ million in 2022 to US$ million in 2029; it is expected to grow at a CAGR of % from 2023 to 2029.

In the Chinese market, The major manufacturers are Dow, Mitsubishi Materials, Corporation, Heraeus, Xiliong Science, AtoTech, Yamato Denki, Meltex, Ishihara Chemical, Raschig GmbH, Japan Pure Chemical, Coatech, Magneto Special Anedes, Vopelius Chemie AG, Moses Lake Industries and JCU International, etc.

This report presents a comprehensive overview, market shares, and growth opportunities of Plating for Microelectronics market by product type, application, key players and key regions and countries.

Market Segmentation:

Segmentation by type

Gold

Zinc

Nickel

Bronze

Tin

Copper

Others

Segmentation by application

MEMS

PCB

IC

Photoelectron

Others

This report also splits the market by region:

Americas

United States

Canada

Mexico

Brazil

APAC

China

Japan

Korea

Southeast Asia

India

Australia

Europe

Germany

France

UK

Italy

Russia

Middle East & Africa

Egypt

South Africa

Israel

Turkey

GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.

DOW

Mitsubishi Materials Corporation

Heraeus

XiLong Scientific

Atotech

Yamato Denki

Meltex

Ishihara Chemical

Raschig GmbH

Japan Pure Chemical

Coatech

MAGNETO special anodes

Vopelius Chemie AG

Moses Lake Industries

JCU International

Please note: The report will take approximately 2 business days to prepare and deliver.