Global Photoresist for Packaging Market Growth 2025-2031

The global Photoresist for Packaging market size is predicted to grow from US$ 156 million in 2025 to US$ 218 million in 2031; it is expected to grow at a CAGR of 5.7% from 2025 to 2031.

According to the World Semiconductor Trade Statistics (WSTS), the industry experienced major ups and downs in 2022. While chip sales reached their highest annual total ever in 2022, a slowdown in the second half of the year significantly limited growth. In 2022, global semiconductor sales will reach US$574 billion, of which US semiconductor companies" sales total US$275 billion, accounting for 48% of the global market. Photoresist for packaging is a subdivision of the semiconductor field. Global photoresist companies for packaging mainly include JSR, TOK, Merck KGaA (AZ), DuPont, Shin-Etsu, Allresist and Futurrex, etc., mainly distributed in Japan, the United States and China (Including Taiwan), the market is highly concentrated, with CR5 approaching 80%.

LP Information, Inc. (LPI) ' newest research report, the “Photoresist for Packaging Industry Forecast” looks at past sales and reviews total world Photoresist for Packaging sales in 2024, providing a comprehensive analysis by region and market sector of projected Photoresist for Packaging sales for 2025 through 2031. With Photoresist for Packaging sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Photoresist for Packaging industry.

This Insight Report provides a comprehensive analysis of the global Photoresist for Packaging landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Photoresist for Packaging portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Photoresist for Packaging market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Photoresist for Packaging and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Photoresist for Packaging.

This report presents a comprehensive overview, market shares, and growth opportunities of Photoresist for Packaging market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Positive Photoresist
Negative Photoresist

Segmentation by Application:
WLP
FC
2.5D/3D Package

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
JSR
TOKYO OHKA KOGYO (TOK)
Merck KGaA (AZ)
DuPont
Shin-Etsu
Allresist
Futurrex
KemLab™ Inc
Youngchang Chemical
Everlight Chemical
Crystal Clear Electronic Material
Kempur Microelectronics Inc
Xuzhou B & C Chemical
Jiangsu Aisen Semiconductor Material
AEMC

Key Questions Addressed in this Report

What is the 10-year outlook for the global Photoresist for Packaging market?

What factors are driving Photoresist for Packaging market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Photoresist for Packaging market opportunities vary by end market size?

How does Photoresist for Packaging break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.