Global Phenolic Resin for Electronic Packaging Market Growth 2025-2031

The global Phenolic Resin for Electronic Packaging market size is predicted to grow from US$ 219 million in 2025 to US$ 307 million in 2031; it is expected to grow at a CAGR of 5.8% from 2025 to 2031.

Phenolic resin for electronic packaging is an electronic grade phenolic resin. Electronic grade phenolic resin can be used for CCL, laminates, EMC, photoresist, phenolic molding compounds, etc. Phenolic resin is mainly used in the field of electronic packaging for EMC, packaging of electronic devices, etc.

United States market for Phenolic Resin for Electronic Packaging is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

China market for Phenolic Resin for Electronic Packaging is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Europe market for Phenolic Resin for Electronic Packaging is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Global key Phenolic Resin for Electronic Packaging players cover Sumitomo Bakelite, Chang Chun Group, Jinan Shengquan Group, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.

LP Information, Inc. (LPI) ' newest research report, the “Phenolic Resin for Electronic Packaging Industry Forecast” looks at past sales and reviews total world Phenolic Resin for Electronic Packaging sales in 2024, providing a comprehensive analysis by region and market sector of projected Phenolic Resin for Electronic Packaging sales for 2025 through 2031. With Phenolic Resin for Electronic Packaging sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Phenolic Resin for Electronic Packaging industry.

This Insight Report provides a comprehensive analysis of the global Phenolic Resin for Electronic Packaging landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Phenolic Resin for Electronic Packaging portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Phenolic Resin for Electronic Packaging market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Phenolic Resin for Electronic Packaging and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Phenolic Resin for Electronic Packaging.

This report presents a comprehensive overview, market shares, and growth opportunities of Phenolic Resin for Electronic Packaging market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Liquid
Solid

Segmentation by Application:
Epoxy Molding Compound (EMC)
Semiconductor Device
Curing Agent/Hardener

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Sumitomo Bakelite
Chang Chun Group
Jinan Shengquan Group

Key Questions Addressed in this Report

What is the 10-year outlook for the global Phenolic Resin for Electronic Packaging market?

What factors are driving Phenolic Resin for Electronic Packaging market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Phenolic Resin for Electronic Packaging market opportunities vary by end market size?

How does Phenolic Resin for Electronic Packaging break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.