Global PI Films for Flexible Printed Circuits (FPC) Market Growth 2024-2030

Global PI Films for Flexible Printed Circuits (FPC) Market Growth 2024-2030

PI films for electronic substrates are mainly used in the preparation of FPC. As an insulating base film and copper foil to form the substrate part of the FCCL, the PI film can be processed into FCCL and then used as a cover film to protect the surface of the FPC.

The global PI Films for Flexible Printed Circuits (FPC) market size is projected to grow from US$ 1245.3 million in 2023 to US$ 2551.2 million in 2030; it is expected to grow at a CAGR of 10.8% from 2024 to 2030.

LP Information, Inc. (LPI) ' newest research report, the “PI Films for Flexible Printed Circuits (FPC) Industry Forecast” looks at past sales and reviews total world PI Films for Flexible Printed Circuits (FPC) sales in 2023, providing a comprehensive analysis by region and market sector of projected PI Films for Flexible Printed Circuits (FPC) sales for 2024 through 2030. With PI Films for Flexible Printed Circuits (FPC) sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world PI Films for Flexible Printed Circuits (FPC) industry.

This Insight Report provides a comprehensive analysis of the global PI Films for Flexible Printed Circuits (FPC) landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on PI Films for Flexible Printed Circuits (FPC) portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global PI Films for Flexible Printed Circuits (FPC) market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for PI Films for Flexible Printed Circuits (FPC) and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global PI Films for Flexible Printed Circuits (FPC).

Currently, the market for PI films for Flexible Printed Circuits (FPC) is in a phase of rapid expansion, witnessing a continual increase in size. The sales of PI films for FPC are experiencing robust growth, driven by the widespread application of flexible printed circuits in electronic products. These high-performance polyimide films exhibit excellent flexibility and high-temperature stability in FPC manufacturing, making them extensively utilized in smartphones, tablets, electronic vehicles, and other advanced electronic devices. Looking ahead, with ongoing innovation in the electronics industry and a growing demand, PI films for FPC are poised to expand into more domains, unlocking further possibilities in the field of flexible electronics.

This report presents a comprehensive overview, market shares, and growth opportunities of PI Films for Flexible Printed Circuits (FPC) market by product type, application, key manufacturers and key regions and countries.

Segmentation by type
Film Thickness Below 10μm
Film Thickness 10-20μm
Film Thickness Above 20μm

Segmentation by application
Consumer Electronics
Medical Electronics
Automotive Electronics
Other

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
DuPont
Kaneka Corporation
PI Advanced Materials
UBE Corporation
Taimide Tech
Rayitek
Shenzhen Danbond Technology
Anhui Guofeng New Materials

Key Questions Addressed in this Report

What is the 10-year outlook for the global PI Films for Flexible Printed Circuits (FPC) market?

What factors are driving PI Films for Flexible Printed Circuits (FPC) market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do PI Films for Flexible Printed Circuits (FPC) market opportunities vary by end market size?

How does PI Films for Flexible Printed Circuits (FPC) break out type, application?

Please note: The report will take approximately 2 business days to prepare and deliver.