Global PCB Heat Sinks Market Growth 2023-2029
The heat sink is a cooling method that transfers dissipated heat from PCB components into a cooling medium. Heat sink works on the principle of conduction which states that heat transfers from an area of high thermal resistance to an area of low thermal resistance.
LPI (LP Information)' newest research report, the “PCB Heat Sinks Industry Forecast” looks at past sales and reviews total world PCB Heat Sinks sales in 2022, providing a comprehensive analysis by region and market sector of projected PCB Heat Sinks sales for 2023 through 2029. With PCB Heat Sinks sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world PCB Heat Sinks industry.
This Insight Report provides a comprehensive analysis of the global PCB Heat Sinks landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on PCB Heat Sinks portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global PCB Heat Sinks market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for PCB Heat Sinks and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global PCB Heat Sinks.
The global PCB Heat Sinks market size is projected to grow from US$ million in 2022 to US$ million in 2029; it is expected to grow at a CAGR of % from 2023 to 2029.
United States market for PCB Heat Sinks is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.
China market for PCB Heat Sinks is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.
Europe market for PCB Heat Sinks is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.
Global key PCB Heat Sinks players cover Advanced Thermal Solutions, Ohmite, CTS Corporation, Moko Technology, CUI Devices, Boyd, Fischer Elektronik, Broadlake and Pada Engineering, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2022.
This report presents a comprehensive overview, market shares, and growth opportunities of PCB Heat Sinks market by product type, application, key manufacturers and key regions and countries.
Market Segmentation:
Segmentation by type
Aluminum
Copper
Others
Segmentation by application
Processors
Power Components
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Advanced Thermal Solutions
Ohmite
CTS Corporation
Moko Technology
CUI Devices
Boyd
Fischer Elektronik
Broadlake
Pada Engineering
Heatell
Shenzhen Mingsihai
Key Questions Addressed in this Report
What is the 10-year outlook for the global PCB Heat Sinks market?
What factors are driving PCB Heat Sinks market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do PCB Heat Sinks market opportunities vary by end market size?
How does PCB Heat Sinks break out type, application?
What are the influences of COVID-19 and Russia-Ukraine war?
Please note: The report will take approximately 2 business days to prepare and deliver.
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