Global PCB Chemical and Semiconductor Packaging Material Market Growth (Status and Outlook) 2025-2031

Global PCB Chemical and Semiconductor Packaging Material Market Growth (Status and Outlook) 2025-2031

The global PCB Chemical and Semiconductor Packaging Material market size is predicted to grow from US$ 31370 million in 2025 to US$ 45760 million in 2031; it is expected to grow at a CAGR of 6.5% from 2025 to 2031.

Global key players of PCB chemical and semiconductor packaging material include Shinko, Jingshuo Technology, Kyocera, etc. Global top three manufacturers hold a share over 10%. The key players are mainly located in North America, Europe, Japan, China, Taiwan (China) and South Korea. In terms of product, semiconductor packaging materials is the largest segment, with a share over 67%. And in terms of application, the largest application is computer and consumer electronics, with a share over 41%.

LPI (LP Information)' newest research report, the “PCB Chemical and Semiconductor Packaging Material Industry Forecast” looks at past sales and reviews total world PCB Chemical and Semiconductor Packaging Material sales in 2024, providing a comprehensive analysis by region and market sector of projected PCB Chemical and Semiconductor Packaging Material sales for 2025 through 2031. With PCB Chemical and Semiconductor Packaging Material sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world PCB Chemical and Semiconductor Packaging Material industry.

This Insight Report provides a comprehensive analysis of the global PCB Chemical and Semiconductor Packaging Material landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on PCB Chemical and Semiconductor Packaging Material portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global PCB Chemical and Semiconductor Packaging Material market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for PCB Chemical and Semiconductor Packaging Material and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global PCB Chemical and Semiconductor Packaging Material.

This report presents a comprehensive overview, market shares, and growth opportunities of PCB Chemical and Semiconductor Packaging Material market by product type, application, key players and key regions and countries.

Segmentation by Type:
PCB Chemicals
Semiconductor Packaging Materials

Segmentation by Application:
Computer and Consumer Electronics
Automotive
Telecommunications
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Atotech
DuPont
MacDermid
JCU CORPORATION
Uyemura
Jetchem International
Guanghua Technology
Feikai material
Fujifilm
Tokyo Ohka Kogyo
JSR
LG Chem
Showa Denko
Sumitomo Bakelite
Shinko
Jingshuo Technology
Kyocera
Xinxing Electronics
Ibiden
South Asia Circuit
Zhending Technology
AAMI
Shennan Circuit
Kangqiang Electronics

Please note: The report will take approximately 2 business days to prepare and deliver.