Global Outsourced Semiconductor Assembly and Test (OSAT) Market Growth (Status and Outlook) 2025-2031

Global Outsourced Semiconductor Assembly and Test (OSAT) Market Growth (Status and Outlook) 2025-2031

The global Outsourced Semiconductor Assembly and Test (OSAT) market size is predicted to grow from US$ 64660 million in 2025 to US$ 88620 million in 2031; it is expected to grow at a CAGR of 5.4% from 2025 to 2031.

OSAT stands for Outsourced Semiconductor Assembly and Test. This report focuses on OSAT Providers. Outsourced Semiconductor Assembly and Test (manufacturing) provide third-party IC-packaging and test services.The OSATs are merchant vendors. IDMs and foundries with internal packaging operations also outsource a certain percentage of their IC-packaging production to the OSATs. The fabless companies also outsource their packaging to the OSATs and/or foundries.

Global Outsourced Semiconductor Assembly and Test (OSAT) key players include ASE Group, Amkor, JECT, SPIL, etc. Global top four manufacturers hold a share over 30%.

United States is the largest market, with a share about 30%, followed by China, and China Taiwan, both have a share about 35 percent.

In terms of product, Assembly Service is the largest segment, with a share about 80%. And in terms of application, the largest application is Communications, followed by Automotive, Computing, Consumer, etc.

LPI (LP Information)' newest research report, the “Outsourced Semiconductor Assembly and Test (OSAT) Industry Forecast” looks at past sales and reviews total world Outsourced Semiconductor Assembly and Test (OSAT) sales in 2024, providing a comprehensive analysis by region and market sector of projected Outsourced Semiconductor Assembly and Test (OSAT) sales for 2025 through 2031. With Outsourced Semiconductor Assembly and Test (OSAT) sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Outsourced Semiconductor Assembly and Test (OSAT) industry.

This Insight Report provides a comprehensive analysis of the global Outsourced Semiconductor Assembly and Test (OSAT) landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Outsourced Semiconductor Assembly and Test (OSAT) portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Outsourced Semiconductor Assembly and Test (OSAT) market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Outsourced Semiconductor Assembly and Test (OSAT) and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Outsourced Semiconductor Assembly and Test (OSAT).

This report presents a comprehensive overview, market shares, and growth opportunities of Outsourced Semiconductor Assembly and Test (OSAT) market by product type, application, key players and key regions and countries.

Segmentation by Type:
Test Service
Assembly Service

Segmentation by Application:
Communications
Automotive
Computing
Consumer
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
ASE Group
Amkor
JECT
SPIL
Powertech Technology Inc
TSHT
TFME
UTAC
Chipbond
ChipMOS
KYEC
Unisem
Walton Advanced Engineering
Signetics
Hana Micron
NEPES

Please note: The report will take approximately 2 business days to prepare and deliver.