Global Multilayer Printed-wiring Board Market Growth 2025-2031

Global Multilayer Printed-wiring Board Market Growth 2025-2031

The global Multilayer Printed-wiring Board market size is predicted to grow from US$ 30580 million in 2025 to US$ 36760 million in 2031; it is expected to grow at a CAGR of 3.1% from 2025 to 2031.

Multilayer PCB is made up of three or more conductive layers(copper foil layer), these layers are pressed together and form multilayer PCB. Copper foil layer is bonded together by PP(prepreg), Multilayer PCB is one of the most complex types in printed circuit board.

Global Multilayer Printed-wiring Board main players include Tripod, Nippon Mektron, Zhen Ding Technology, Unimicron, Shennan, TPT, etc., totally accounting for about 11% of market. China is the largest market of Multilayer Printed-wiring Board, with a share over 60%. As for the types of products, it can be divided into Layer 4-6, Layer 8-10 and Layer 10+. The most common product is Layer 4-6, with a share over 64%. In terms of applications, it is widely used in consumer electronics, communications, computer related industry, automotive industry and others. The most application is communications, with a share over 31%.

LP Information, Inc. (LPI) ' newest research report, the “Multilayer Printed-wiring Board Industry Forecast” looks at past sales and reviews total world Multilayer Printed-wiring Board sales in 2024, providing a comprehensive analysis by region and market sector of projected Multilayer Printed-wiring Board sales for 2025 through 2031. With Multilayer Printed-wiring Board sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Multilayer Printed-wiring Board industry.

This Insight Report provides a comprehensive analysis of the global Multilayer Printed-wiring Board landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Multilayer Printed-wiring Board portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Multilayer Printed-wiring Board market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Multilayer Printed-wiring Board and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Multilayer Printed-wiring Board.

This report presents a comprehensive overview, market shares, and growth opportunities of Multilayer Printed-wiring Board market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Layer 4-6
Layer 8-10
Layer 10+

Segmentation by Application:
Consumer Electronics
Communications
Computer Related Industry
Automotive Industry
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Nippon Mektron
Zhen Ding Technology
Unimicron
Young Poong Group
SEMCO
Ibiden
Tripod
TTM Technologies
Sumitomo Electric SEI
Daeduck Group
Nan Ya PCB
Compeq
HannStar Board
LG Innotek
AT&S
Meiko
WUS
TPT
Chin-Poon
Shennan

Key Questions Addressed in this Report

What is the 10-year outlook for the global Multilayer Printed-wiring Board market?

What factors are driving Multilayer Printed-wiring Board market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Multilayer Printed-wiring Board market opportunities vary by end market size?

How does Multilayer Printed-wiring Board break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.