Global Molded Interconnect Device (MID) Market Growth 2023-2029

Global Molded Interconnect Device (MID) Market Growth 2023-2029

The global Molded Interconnect Device (MID) market size is projected to grow from US$ 32870 million in 2022 to US$ 39320 million in 2029; it is expected to grow at a CAGR of 2.6% from 2023 to 2029.

United States market for Molded Interconnect Device (MID) is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.

China market for Molded Interconnect Device (MID) is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.

Europe market for Molded Interconnect Device (MID) is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.

Global key Molded Interconnect Device (MID) players cover Molex LLC, TE Connectivity, Amphenol Corporation, LPKF Laser & Electronics AG, 2E mechatronic GmbH & Co. KG, Harting Technologiegruppe, Arlington Plating Company, MID Solutions and MacDermid Inc., etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2022.

Molded interconnect device refers to three-dimensional electromechanical components that combine the finest of mechanical and electrical engineering. These are used to describe the method of producing selectively plated plastic pieces.

LPI (LP Information)' newest research report, the “Molded Interconnect Device (MID) Industry Forecast” looks at past sales and reviews total world Molded Interconnect Device (MID) sales in 2022, providing a comprehensive analysis by region and market sector of projected Molded Interconnect Device (MID) sales for 2023 through 2029. With Molded Interconnect Device (MID) sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Molded Interconnect Device (MID) industry.

This Insight Report provides a comprehensive analysis of the global Molded Interconnect Device (MID) landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Molded Interconnect Device (MID) portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global Molded Interconnect Device (MID) market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Molded Interconnect Device (MID) and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Molded Interconnect Device (MID).

This report presents a comprehensive overview, market shares, and growth opportunities of Molded Interconnect Device (MID) market by product type, application, key manufacturers and key regions and countries.

Market Segmentation:

Segmentation by type
Antenna and Connectivity Modules
Connectors and Switches
Sensors
Lighting

Segmentation by application
Automotive
Healthcare
Industrial
Military
Aerospace

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Molex LLC
TE Connectivity
Amphenol Corporation
LPKF Laser & Electronics AG 2E mechatronic GmbH & Co. KG
Harting Technologiegruppe
Arlington Plating Company
MID Solutions
MacDermid Inc.
JOHNAN Corporation
TactoTek Oy
Axon' Cable S.A.S
S2P Solutions
Suzhou Cicor Technology Co. Ltd.
Chogori Technology

Key Questions Addressed in this Report

What is the 10-year outlook for the global Molded Interconnect Device (MID) market?

What factors are driving Molded Interconnect Device (MID) market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Molded Interconnect Device (MID) market opportunities vary by end market size?

How does Molded Interconnect Device (MID) break out type, application?

What are the influences of COVID-19 and Russia-Ukraine war?

Please note: The report will take approximately 2 business days to prepare and deliver.