Global Millimeter-wave Radar Advanced Packaging Market Growth (Status and Outlook) 2025-2031

The global Millimeter-wave Radar Advanced Packaging market size is predicted to grow from US$ 907 million in 2025 to US$ 1164 million in 2031; it is expected to grow at a CAGR of 4.3% from 2025 to 2031.

Millimeter-wave radar advanced packaging refers to packaging technologies and methods designed for millimeter-wave radar systems that have high precision, high reliability, high performance, good heat dissipation and low cost. Advanced packaging technology can ensure that the various components of the millimeter-wave radar system, such as transceiver chips, antennas, etc., are integrated together in a high-precision manner, thereby improving the overall performance of the system. By optimizing the packaging structure and materials, electromagnetic interference and signal loss can be reduced, and the detection accuracy and resolution of the radar system can be improved.

United States market for Millimeter-wave Radar Advanced Packaging is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

China market for Millimeter-wave Radar Advanced Packaging is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Europe market for Millimeter-wave Radar Advanced Packaging is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Global key Millimeter-wave Radar Advanced Packaging players cover ASE Holdings, Amkor, SPIL, JCET Group, Stats Chippac, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.

LPI (LP Information)' newest research report, the “Millimeter-wave Radar Advanced Packaging Industry Forecast” looks at past sales and reviews total world Millimeter-wave Radar Advanced Packaging sales in 2024, providing a comprehensive analysis by region and market sector of projected Millimeter-wave Radar Advanced Packaging sales for 2025 through 2031. With Millimeter-wave Radar Advanced Packaging sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Millimeter-wave Radar Advanced Packaging industry.

This Insight Report provides a comprehensive analysis of the global Millimeter-wave Radar Advanced Packaging landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Millimeter-wave Radar Advanced Packaging portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Millimeter-wave Radar Advanced Packaging market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Millimeter-wave Radar Advanced Packaging and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Millimeter-wave Radar Advanced Packaging.

This report presents a comprehensive overview, market shares, and growth opportunities of Millimeter-wave Radar Advanced Packaging market by product type, application, key players and key regions and countries.

Segmentation by Type:
Flip-chip (FCCSP) Packaging
Fan-out (eWLB) Packaging

Segmentation by Application:
Cars
Drones
Robots
Other

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
ASE Holdings
Amkor
SPIL
JCET Group
Stats Chippac
J-Devices
UTAC
CETC
Unisem

Please note: The report will take approximately 2 business days to prepare and deliver.