Global Metal Shell for Microelectronic Packages Market Growth 2023-2029

Global Metal Shell for Microelectronic Packages Market Growth 2023-2029

Metal is still the main material of electronic packaging because of its advantages such as good mechanical strength, good thermal conductivity, electromagnetic shielding function and convenient machining. Metal packaging refers to the metal as the main material of the tube shell, directly or indirectly through the substrate to install the chip on the tube seat, with a lead wire connected to the internal and external circuit of an electronic packaging form. It is widely used in the packaging of hybrid circuits, mainly for military, civil and customized special airtight packaging, among which, it has been widely used in the military and aerospace fields. The various forms of metal packaging and flexible processing can be integrated with some components (such as hybrid integrated A/D or D/A converters), suitable for low I/O single chip and multi-chip applications, RF, microwave, optoelectronic, surface acoustic wave and high power devices, can meet the requirements of small batch, high reliability. In addition, in order to solve the problem of packaging heat dissipation, all kinds of packaging also mostly use metal as heat sink and heat sink.
Traditional metal materials include: Cu, Al, Kovar alloy (Fe-Ni-Co alloy), Invar alloy (Ni-Fe alloy), W, Mo alloy and so on.
Most metal packages are physical packages. Metal packaging materials in order to achieve the total piece support, electrical connection, heat dissipation, mechanical and environmental protection, usually have the following requirements; ① has good heat conduction and heat dissipation; ② good conductivity, reduce transmission delay and energy loss and sweep; (3) light weight, at the same time requires sufficient strength and mechanical properties; ④ Good processing capacity for mass production; (5) Low thermal expansion coefficient, in order to meet the match with the chip, thereby reducing the generation of thermal stress; Good welding performance, coating performance and corrosion resistance to achieve reliable combination with the chip, sealing and environmental protection.
LPI (LP Information)' newest research report, the “Metal Shell for Microelectronic Packages Industry Forecast” looks at past sales and reviews total world Metal Shell for Microelectronic Packages sales in 2022, providing a comprehensive analysis by region and market sector of projected Metal Shell for Microelectronic Packages sales for 2023 through 2029. With Metal Shell for Microelectronic Packages sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Metal Shell for Microelectronic Packages industry.
This Insight Report provides a comprehensive analysis of the global Metal Shell for Microelectronic Packages landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Metal Shell for Microelectronic Packages portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global Metal Shell for Microelectronic Packages market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Metal Shell for Microelectronic Packages and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Metal Shell for Microelectronic Packages.
The global Metal Shell for Microelectronic Packages market size is projected to grow from US$ 1950.8 million in 2022 to US$ 1936.7 million in 2029; it is expected to grow at a CAGR of 1936.7 from 2023 to 2029.
In terms of market sales, China accounts for 22% of global market share.
In terms of suppliers, the world's leading manufacturers of metal packaging and shell include AMETEK(GSP), SCHOTT, Complete Hermetics, KOTO, Kyocera, SGA Technologies, Century Seals, Kairui, Jiangsu Dongcheng Micro-electronics, Taizhou Hangyu Electric Appliance, CETC40, Bojing Electronics, CETC43, SINOPIONEER, CCTC, Xingchuang, Rizhao Xunsun Electronics and Shengda Technology. The top five together account for 40% of the market.
In the consumer application market, the main application fields are concentrated in aerospace, petrochemical industry, automobile, optical communication and other fields. Among them, optical communication is the largest application field, with more than 31% of the metal shells used for packaging concentrated in optical communication.
This report presents a comprehensive overview, market shares, and growth opportunities of Metal Shell for Microelectronic Packages market by product type, application, key manufacturers and key regions and countries.
Market Segmentation:
Segmentation by type
TO Shell
Flat Shell
Segmentation by application
Aeronautics and Astronautics
Petrochemical Industry
Automobile
Optical Communication
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
AMETEK(GSP)
SCHOTT
Complete Hermetics
KOTO
Kyocera
SGA Technologies
Century Seals
KaiRui
Jiangsu Dongguang Micro-electronics
Taizhou Hangyu Electric Appliance
CETC40
BOJING ELECTRONICS
CETC43
SINOPIONEER
CCTC
XingChuang
Rizhao Xuri Electronics Co., Ltd.
ShengDa Technology
Key Questions Addressed in this Report
What is the 10-year outlook for the global Metal Shell for Microelectronic Packages market?
What factors are driving Metal Shell for Microelectronic Packages market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Metal Shell for Microelectronic Packages market opportunities vary by end market size?
How does Metal Shell for Microelectronic Packages break out type, application?
What are the influences of COVID-19 and Russia-Ukraine war?

Please note: The report will take approximately 2 business days to prepare and deliver.