Global Memory Semiconductor Packaging Market Growth (Status and Outlook) 2023-2029

Global Memory Semiconductor Packaging Market Growth (Status and Outlook) 2023-2029

The global Memory Semiconductor Packaging market size is projected to grow from US$ million in 2022 to US$ million in 2029; it is expected to grow at a CAGR of % from 2023 to 2029.

Since the outbreak of the epidemic in 2020, remote office, online education, streaming media and other applications have triggered an increase in demand for consumer electronics and cloud services, and the global Digital transformation has accelerated. At the same time, the semiconductor industry, including storage chips, has formed a global comprehensive shortage wave that has lasted for nearly two years due to sudden demand and accelerated supply chain hoarding.

However, since the third quarter of 2021, the comprehensive shortage of supply and demand has transformed into a structural imbalance between supply and demand. The phenomenon of long and short materials continues to ferment in major end markets, and the inventory level of enterprises is gradually piling up, leading to a cycle of inventory adjustment downstream. In 2022, under the impact of a series of events such as the Russia-Ukraine conflict, the resurgence of the epidemic, and rising inflation, the risk of global economic downturn has intensified. The demand for smart phones, PCs and other technology products is rapidly declining. The dilemma of "low demand and high inventory" is constantly fermenting, leading to a rapid change in the supply and demand relationship. The market situation of oversupply has led to further decline in the market.

The three-year "pandemic dividend" has subsided, and 2022 has become a turning point, bringing the growth of the storage market to an end. According to the CFM flash memory market, the NAND Flash market capacity is expected to grow by 6% to 610 B GB in 2022, while the DRAM market capacity is expected to grow by 4% to 194 B Gb. Compared to the previous NAND Flash and DRAM, which maintained growth rates of over 30% and 20% respectively, the growth rates of 6% and 4% in 2022 are undoubtedly at historical lows. It is expected to return to the growth rates of 20% and 10% in 2023 under the premise of improved demand.

Packaging is an essential part of semiconductor manufacturing and design. It affects power, performance, and cost on a macro level, and the basic functionality of all chips on a micro level. The package is the container that holds the semiconductor die. The packaging may be done by a separate vendor, the OSAT, although foundries are expanding their packaging efforts. The package protects the die, connects the chip to a board or other chips, and may dissipate heat. This report focuses on Memory Semiconductor Packaging market.

LPI (LP Information)' newest research report, the “Memory Semiconductor Packaging Industry Forecast” looks at past sales and reviews total world Memory Semiconductor Packaging sales in 2022, providing a comprehensive analysis by region and market sector of projected Memory Semiconductor Packaging sales for 2023 through 2029. With Memory Semiconductor Packaging sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Memory Semiconductor Packaging industry.

This Insight Report provides a comprehensive analysis of the global Memory Semiconductor Packaging landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Memory Semiconductor Packaging portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Memory Semiconductor Packaging market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Memory Semiconductor Packaging and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Memory Semiconductor Packaging.

This report presents a comprehensive overview, market shares, and growth opportunities of Memory Semiconductor Packaging market by product type, application, key players and key regions and countries.

Market Segmentation:

Segmentation by type
OSATs
IDM

Segmentation by application
DRAM
3D NAND
SRAM
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Samsung
Micron
Hynix
Amkor
YMTC
CXMT

Please note: The report will take approximately 2 business days to prepare and deliver.