Global Memory Chip Packaging Substrate Market Growth 2024-2030

Global Memory Chip Packaging Substrate Market Growth 2024-2030

IC substrate is the core material of the packaging link and has a high technical threshold. IC substrate directly loads the chip, provides an electronic connection between the chip and the PCB motherboard, plays the role of "connecting the above and the next", and is a necessary core material in IC packaging technology. With the development of semiconductor technology, the characteristic size of IC continues to shrink, and the integration continues to improve. The corresponding IC package towards super multi-pin, narrow pitch, ultra-miniaturization direction in high-level packaging, IC substrate has replaced the traditional lead frame, becoming an indispensable part of the IC package. Memory chip packaging substrate is mainly used for smartphone and tablet computer storage modules and solid state disks.

The global Memory Chip Packaging Substrate market size is projected to grow from US$ million in 2024 to US$ million in 2030; it is expected to grow at a CAGR of %from 2024 to 2030.

LP Information, Inc. (LPI) ' newest research report, the “Memory Chip Packaging Substrate Industry Forecast” looks at past sales and reviews total world Memory Chip Packaging Substrate sales in 2023, providing a comprehensive analysis by region and market sector of projected Memory Chip Packaging Substrate sales for 2024 through 2030. With Memory Chip Packaging Substrate sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Memory Chip Packaging Substrate industry.

This Insight Report provides a comprehensive analysis of the global Memory Chip Packaging Substrate landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Memory Chip Packaging Substrate portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Memory Chip Packaging Substrate market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Memory Chip Packaging Substrate and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Memory Chip Packaging Substrate.

The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.

This report presents a comprehensive overview, market shares, and growth opportunities of Memory Chip Packaging Substrate market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
WB BGA
WB-CSP
Others

Segmentation by Application:
Flash Drive
Solid State Storage
Embedded Storage
Volatile Storage
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Samsung Electro-Mechanics
Simmtech
Daeduck
Korea Circuit
Ibiden
Kyocera
ASE Group
Shinko
Fujitsu Global
Doosan Electronic
Toppan Printing
Unimicron
Kinsus
Nanya
Fastprint Circuit
Shennan Circuits

Key Questions Addressed in this Report

What is the 10-year outlook for the global Memory Chip Packaging Substrate market?

What factors are driving Memory Chip Packaging Substrate market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Memory Chip Packaging Substrate market opportunities vary by end market size?

How does Memory Chip Packaging Substrate break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.