Global Low Temperature Thermosetting Structural Adhesive Market Growth 2024-2030

Global Low Temperature Thermosetting Structural Adhesive Market Growth 2024-2030

Low-temperature thermosetting structural adhesive is a one-component, fast-curing modified epoxy adhesive. It is designed specifically for CSP (FBGA) or BGA and is a reworkable underfill. This glue can form a consistent and defect-free underfill layer, effectively reducing the impact caused by the thermal expansion coefficient mismatch between the chip and the substrate or external forces, thereby improving product reliability1. Low-temperature thermosetting glue usually refers to epoxy resin glue that is heated and cured under lower temperature conditions (such as 60 degrees, 70 degrees, 80 degrees), and is suitable for certain precision electronic components or LED components that are not resistant to high temperatures.

The global Low Temperature Thermosetting Structural Adhesive market size is projected to grow from US$ million in 2024 to US$ million in 2030; it is expected to grow at a CAGR of %from 2024 to 2030.

LP Information, Inc. (LPI) ' newest research report, the “Low Temperature Thermosetting Structural Adhesive Industry Forecast” looks at past sales and reviews total world Low Temperature Thermosetting Structural Adhesive sales in 2023, providing a comprehensive analysis by region and market sector of projected Low Temperature Thermosetting Structural Adhesive sales for 2024 through 2030. With Low Temperature Thermosetting Structural Adhesive sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Low Temperature Thermosetting Structural Adhesive industry.

This Insight Report provides a comprehensive analysis of the global Low Temperature Thermosetting Structural Adhesive landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Low Temperature Thermosetting Structural Adhesive portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Low Temperature Thermosetting Structural Adhesive market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Low Temperature Thermosetting Structural Adhesive and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Low Temperature Thermosetting Structural Adhesive.

United States market for Low Temperature Thermosetting Structural Adhesive is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.

China market for Low Temperature Thermosetting Structural Adhesive is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.

Europe market for Low Temperature Thermosetting Structural Adhesive is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.

Global key Low Temperature Thermosetting Structural Adhesive players cover Henkel, 3M, Sika, Huntsman Corporation, LORD Corporation, etc. In terms of revenue, the global two largest companies occupied for a share nearly

% in 2023.

This report presents a comprehensive overview, market shares, and growth opportunities of Low Temperature Thermosetting Structural Adhesive market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Epoxy Glue
Polyurethane Glue
Acrylic Glue

Segmentation by Application:
Consumer Electronics Industry
Aerospace Industry
Machinery Industry
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Henkel
3M
Sika
Huntsman Corporation
LORD Corporation
H.B. Fuller
Permabond
ITW Performance Polymers
Master Bond
Panacol-Elosol
Pidilite Industries
Dymax Corporation
Chemence
Techsil Limited
Budnick Converting
Protavic America
Bostik
Copps Industries, Inc.
Dexerials

Key Questions Addressed in this Report

What is the 10-year outlook for the global Low Temperature Thermosetting Structural Adhesive market?

What factors are driving Low Temperature Thermosetting Structural Adhesive market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Low Temperature Thermosetting Structural Adhesive market opportunities vary by end market size?

How does Low Temperature Thermosetting Structural Adhesive break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.