Global Low Temperature Solder Pastes Market Growth 2025-2031

Global Low Temperature Solder Pastes Market Growth 2025-2031

The global Low Temperature Solder Pastes market size is predicted to grow from US$ 341 million in 2025 to US$ 476 million in 2031; it is expected to grow at a CAGR of 5.7% from 2025 to 2031.

Solder paste, a unique combination of minute metal solder particle and slimy flux, is exclusively known for its usage in the printed circuit board or PCB manufacturing. This special paste attaches the mount particles to pads on the board and creates a stable bond between two different work elements. In this process, the sizes of the metal particles and the density of the flux play a significant role and decide the outcome of the solder paste.

Low-temperature solder paste, is a very extraordinary blend of tiny metal particles and sticky flux. This easily dissolves even at a temperature under 180° C. Usually, the typical solder paste temperature extends over 250° C to 240° C, which often becomes destructive for some delicate particles. A solder paste having a melting point of 138 ° C is called a low-temperature solder paste.

Global Low Temperature Solder Pastes key players include Alpha, Senju, Vital New Material and Tamura, etc. Global top four manufacturers hold a share over 45%.

The largest consumer market is Asia-Pacific, has a share about 65%, followed by North America and Europe, with around 27% and 5% market share respectively.

In terms of product, Silver-free is the largest segment, with a share about 80%. And in terms of application, the largest application is Stencil Printing followed by Solder Dispensing, etc.

With the miniaturization and lightweight development of electronic products, more and more heat-sensitive components are used in these products, which promotes the application of low-temperature solder paste. The use of heat-sensitive components in modern electronic products is becoming more and more common, such as LEDs, ceramic substrates, etc. These components cannot withstand the high-temperature soldering of traditional solder paste. Low-temperature solder paste has multiple functions, such as thermal conductivity, insulation, etc., to meet more diverse application requirements. By optimizing the composition and production process, the long-term stability and reliability of low-temperature solder paste can be improved.

LP Information, Inc. (LPI) ' newest research report, the “Low Temperature Solder Pastes Industry Forecast” looks at past sales and reviews total world Low Temperature Solder Pastes sales in 2024, providing a comprehensive analysis by region and market sector of projected Low Temperature Solder Pastes sales for 2025 through 2031. With Low Temperature Solder Pastes sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Low Temperature Solder Pastes industry.

This Insight Report provides a comprehensive analysis of the global Low Temperature Solder Pastes landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Low Temperature Solder Pastes portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Low Temperature Solder Pastes market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Low Temperature Solder Pastes and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Low Temperature Solder Pastes.

This report presents a comprehensive overview, market shares, and growth opportunities of Low Temperature Solder Pastes market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Silver Contained
Silver-free

Segmentation by Application:
Solder Dispensing
Stencil Printing
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Alpha
Senju
Vital New Material
Indium Corporation
Genma
Tamura
Qualitek
AIM
Henkel
Inventec
Shenmao
Tongfang Tech
KOKI
Superior Flux
Nihon Superior
Shenzhen Youtel Nanotechnology
Shenzhen Fitech
Shenzhen XinFujin New Material
SHENMAO Technology

Key Questions Addressed in this Report

What is the 10-year outlook for the global Low Temperature Solder Pastes market?

What factors are driving Low Temperature Solder Pastes market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Low Temperature Solder Pastes market opportunities vary by end market size?

How does Low Temperature Solder Pastes break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.