Global Low Pressure Molding Hot Melt Adhesive Market Growth 2025-2031

Global Low Pressure Molding Hot Melt Adhesive Market Growth 2025-2031

The global Low Pressure Molding Hot Melt Adhesive market size is predicted to grow from US$ 255 million in 2025 to US$ 388 million in 2031; it is expected to grow at a CAGR of 7.2% from 2025 to 2031.

The low-pressure injection molding process is a packaging process that uses very low injection pressure to inject hot-melt adhesive material into the mold and quickly solidifies it (the speed only takes 1-50 seconds). It uses hot-melt adhesive as the material and has excellent sealing properties. And excellent physical properties, product performance achieves insulation, temperature resistance, impact resistance, shock absorption, moisture-proof, waterproof, dust-proof, chemical corrosion resistance and other functions.

This process is currently mainly used in the packaging and protection of precision and sensitive electronic components, including: printed circuit boards (PCBs), automotive electronics, mobile phone batteries, wiring harnesses, waterproof connectors, sensors, micro switches, inductors, and antennas etc.

Low-pressure injection molding plays a good role in protecting electronic components. The traditional injection molding process has defects due to excessive pressure. Because low-pressure molding requires only a small pressure to make the melt flow into a small mold space, it will not damage the fragile components that need to be packaged, greatly reducing the cost. The low-pressure injection molding process is not only environmentally friendly, but also greatly improves production efficiency and can help reduce the total production cost.

Low pressure injection molding hot melt adhesive. This material is able to reach small areas without high pressure, making it ideal for sensitive components. The adhesive properties of polyamide provide optimal bonding and effectively seal against moisture and other environmental contaminants. The high chemical resistance of low-pressure molding hot melt adhesives represented by polyamide to oil, diesel, grease and weak acids also improves the performance of the finished product.

The global key manufacturers of low pressure molding hot melt adhesives are Henkel, Bostik and Huntsman. The top two manufacturers have a market share of about 70%. Global origins are mainly in North America, Europe and China, with Europe being the largest production region, holding more than 40% of the market share. By far, polyamide is the largest product segment, with a market share of around 90%. Meanwhile, in terms of applications, consumer electronics is the largest application, with about 65% of the market share.

LP Information, Inc. (LPI) ' newest research report, the “Low Pressure Molding Hot Melt Adhesive Industry Forecast” looks at past sales and reviews total world Low Pressure Molding Hot Melt Adhesive sales in 2024, providing a comprehensive analysis by region and market sector of projected Low Pressure Molding Hot Melt Adhesive sales for 2025 through 2031. With Low Pressure Molding Hot Melt Adhesive sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Low Pressure Molding Hot Melt Adhesive industry.

This Insight Report provides a comprehensive analysis of the global Low Pressure Molding Hot Melt Adhesive landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Low Pressure Molding Hot Melt Adhesive portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Low Pressure Molding Hot Melt Adhesive market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Low Pressure Molding Hot Melt Adhesive and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Low Pressure Molding Hot Melt Adhesive.

This report presents a comprehensive overview, market shares, and growth opportunities of Low Pressure Molding Hot Melt Adhesive market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Polyamide
Polyolefin
Others

Segmentation by Application:
Consumer Electronics
Automotive
Medical Devices
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Henkel
Bostik
Huntsman
SUNTIP
Austromelt
Bühnen
KY Chemical

Key Questions Addressed in this Report

What is the 10-year outlook for the global Low Pressure Molding Hot Melt Adhesive market?

What factors are driving Low Pressure Molding Hot Melt Adhesive market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Low Pressure Molding Hot Melt Adhesive market opportunities vary by end market size?

How does Low Pressure Molding Hot Melt Adhesive break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.