Global Laser Processing Equipment for PCB and FPC Market Growth 2023-2029
LPI (LP Information)' newest research report, the “Laser Processing Equipment for PCB and FPC Industry Forecast” looks at past sales and reviews total world Laser Processing Equipment for PCB and FPC sales in 2022, providing a comprehensive analysis by region and market sector of projected Laser Processing Equipment for PCB and FPC sales for 2023 through 2029. With Laser Processing Equipment for PCB and FPC sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Laser Processing Equipment for PCB and FPC industry.
This Insight Report provides a comprehensive analysis of the global Laser Processing Equipment for PCB and FPC landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Laser Processing Equipment for PCB and FPC portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global Laser Processing Equipment for PCB and FPC market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Laser Processing Equipment for PCB and FPC and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Laser Processing Equipment for PCB and FPC.
The global Laser Processing Equipment for PCB and FPC market size is projected to grow from US$ 6243.2 million in 2022 to US$ 12760 million in 2029; it is expected to grow at a CAGR of 12760 from 2023 to 2029.
Global key players of laser processing equipment for PCB and FPC include Trumpf, Amada, LPKF, Mitsubishi Electric, EO Technics, etc. Global top five manufacturers hold a share over 19%. The key players are mainly located in Europe, North America, China, and Japan. In terms of product, laser cutter is the largest segment, with a share over 57%. And in terms of application, the largest application is PCB, with a share over 78%, followed by FPC.
This report presents a comprehensive overview, market shares, and growth opportunities of Laser Processing Equipment for PCB and FPC market by product type, application, key manufacturers and key regions and countries.
Market Segmentation:
Segmentation by type
Laser Cutter
Laser Soldering Machine
Laser Marking Machine
Others
Segmentation by application
PCB
FPC
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Trumpf
Amada
LPKF
Mitsubishi Electric
EO Technics
Trotec
IPG Photonics
Han'S Laser
HG Laser
Shenzhen Hymson Laser IntelligentEquipmentsCo.,Ltd.
United Winners
Delphilaser
Yawei
MICROMACH
Key Questions Addressed in this Report
What is the 10-year outlook for the global Laser Processing Equipment for PCB and FPC market?
What factors are driving Laser Processing Equipment for PCB and FPC market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Laser Processing Equipment for PCB and FPC market opportunities vary by end market size?
How does Laser Processing Equipment for PCB and FPC break out type, application?
What are the influences of COVID-19 and Russia-Ukraine war?
Please note: The report will take approximately 2 business days to prepare and deliver.
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