Global Laser Grooving Equipment for Semiconductor Market Growth 2023-2029

Global Laser Grooving Equipment for Semiconductor Market Growth 2023-2029

Laser grooving equipment for semiconductor is a kind of machine that through laser scribing, remove the Low-k substances in the wafer saw track and the coating formed by the metal wiring layer in advance, thereby reducing the occurrence of chip defects and improving chip production efficiency in the subsequent blade dicing process.

LPI (LP Information)' newest research report, the “Laser Grooving Equipment for Semiconductor Industry Forecast” looks at past sales and reviews total world Laser Grooving Equipment for Semiconductor sales in 2022, providing a comprehensive analysis by region and market sector of projected Laser Grooving Equipment for Semiconductor sales for 2023 through 2029. With Laser Grooving Equipment for Semiconductor sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Laser Grooving Equipment for Semiconductor industry.

This Insight Report provides a comprehensive analysis of the global Laser Grooving Equipment for Semiconductor landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Laser Grooving Equipment for Semiconductor portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global Laser Grooving Equipment for Semiconductor market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Laser Grooving Equipment for Semiconductor and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Laser Grooving Equipment for Semiconductor.

The global Laser Grooving Equipment for Semiconductor market size is projected to grow from US$ 342 million in 2022 to US$ 912.2 million in 2029; it is expected to grow at a CAGR of 912.2 from 2023 to 2029.

Global top five manufacturers of laser grooving equipment for semiconductor occupied for a share over 80 percent, key players are DISCO, ASM Laser Separation International (ALSI), EO Technics, Wuhan DR Laser Technology and Delphi Laser etc. Geographically speaking, Japan holds the most of global market share, about 30%. China holds about 25% of share, while North America followed by nearly 20%. In terms of product, the type of 12 Inch is the largest segment, with a share over 45%. And in terms of application, the largest application is semiconductor wafer, which takes nearly 70%.

This report presents a comprehensive overview, market shares, and growth opportunities of Laser Grooving Equipment for Semiconductor market by product type, application, key manufacturers and key regions and countries.

Market Segmentation:

Segmentation by type
8 Inch
12 Inch
Others

Segmentation by application
Semiconductor Wafer
Solar Cells

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
DISCO
ASMPT
EO Technics
Wuhan Dr Laser Technology
Delphi Laser
Synova
Suzhou Maxwell Technologies
Suzhou Lumi Laser Technology
Han's Laser Technology

Key Questions Addressed in this Report

What is the 10-year outlook for the global Laser Grooving Equipment for Semiconductor market?

What factors are driving Laser Grooving Equipment for Semiconductor market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Laser Grooving Equipment for Semiconductor market opportunities vary by end market size?

How does Laser Grooving Equipment for Semiconductor break out type, application?

What are the influences of COVID-19 and Russia-Ukraine war?

Please note: The report will take approximately 2 business days to prepare and deliver.