Global Laser Dicing Machine for Semiconductor Market Growth 2024-2030

Global Laser Dicing Machine for Semiconductor Market Growth 2024-2030

Wafer fabs continually face challenges in manufacturing semiconductor devices because the devices continue to get tinier and more complicated. Integrated circuits continue to increase in circuit density. Trends in chip design and materials, such as using die attach films and wafers as thin as 50 μm, add to the complexity of manufacturing. In fabrication processes, wafer dicing plays an early and critical role in the quality of the final product.

Silicon wafers thicker than 100 μm traditionally are cut by diamond blades or saws, and the blade’ s thickness, grit size, and rotating and cutting speeds affect the cutting quality. This technique has been refined over the years, yet it still causes problems that cannot be ignored. Chipping of the wafer occurs because of the force of the sawing process. The large cut width (kerf) caused by the blade wastes the wafer and produces debris that must be cleaned up. Other issues include wearing down of the blade over time and the cost of blade replacement.

For silicon wafers less than 100 μm thick, laser ablation offers an alternative to the blade technique, which is too powerful for the delicate thin wafers. However, laser ablation has its own problems. Vaporizing the wafer with a laser along the dicing path creates molten debris and microcracks. The debris deposited on the surface of the wafer is difficult to clean up, and the cracks result in chips with lower strength.

In contrast, stealth dicing does not generate the problems brought on by either the blade or laser ablation techniques. With stealth dicing, there is no chipping or debris, which eliminates the need for a cleanup process. It also reduces the amount of wasted wafer because of its very narrow dicing path, offering space on the wafer for more chips and higher production yield. Also, the technique does not cause heat damage because the laser cuts below the surface of the wafer; this contributes to rendering the chips more resistant to breakage.

The global Laser Dicing Machine for Semiconductor market size is projected to grow from US$ 336 million in 2024 to US$ 437 million in 2030; it is expected to grow at a CAGR of 4.5% from 2024 to 2030.

LP Information, Inc. (LPI) ' newest research report, the “Laser Dicing Machine for Semiconductor Industry Forecast” looks at past sales and reviews total world Laser Dicing Machine for Semiconductor sales in 2023, providing a comprehensive analysis by region and market sector of projected Laser Dicing Machine for Semiconductor sales for 2024 through 2030. With Laser Dicing Machine for Semiconductor sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Laser Dicing Machine for Semiconductor industry.

This Insight Report provides a comprehensive analysis of the global Laser Dicing Machine for Semiconductor landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Laser Dicing Machine for Semiconductor portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Laser Dicing Machine for Semiconductor market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Laser Dicing Machine for Semiconductor and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Laser Dicing Machine for Semiconductor.

Global key manufacturers of Laser Dicing Machine for Semiconductor include DISCO, Wuxi Autowell, Suzhou Quick Laser Technology Co, Han's Laser Technology Co, DelphiLaser, etc. Global top five manufacturers hold a share about 51%. Asia-Pacific is the largest market of Laser Dicing Machine for Semiconductor, holds a share over 77%. And in terms of application, the largest application is Seal Testing, with a share of over 31%.

This report presents a comprehensive overview, market shares, and growth opportunities of Laser Dicing Machine for Semiconductor market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Traditional Dicing
Stealth Dicing

Segmentation by Application:
Foundry
IDM
Seal Testing
PV Industry
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
DISCO Corporation
Wuxi Autowell Technology Co
Han's Laser Technology Co
Wuhan Huagong Laser Engineering Co
Suzhou Delphi Laser Co
Tokyo Seimitsu
Suzhou Maxwell Technologies Co
Suzhou Quick Laser Technology Co
EO Technics
Synova S.A.
Shenzhen Guangyuan Intelligent Equipment Co
China Electronics Technology Group Corporation
3D-Micromac AG
Genesem
ASMPT
GIE
Suzhou Lumi Laser Technology Co
Corning

Key Questions Addressed in this Report

What is the 10-year outlook for the global Laser Dicing Machine for Semiconductor market?

What factors are driving Laser Dicing Machine for Semiconductor market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Laser Dicing Machine for Semiconductor market opportunities vary by end market size?

How does Laser Dicing Machine for Semiconductor break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.