Global LTCC and HTCC Market Growth (Status and Outlook) 2023-2029

Global LTCC and HTCC Market Growth (Status and Outlook) 2023-2029

HTCC Substrate means High Temperature Co-fired Ceramics Substrate, that is a kind of multilayer ceramic substrate obtained by co-firing a ceramic with a metal pattern such as tungsten or molybdenum which as a high melting point property. Generally, the fired temperature of HTCC substrate is 1500 to 1600 C. HTCC substrate provides the properties of high strength, good heat dissipation, high reliability. The technology is also used for a multi-layer packaging for the electronics industry, such as military electronics, MEMS, microprocessor and RF applications.

This report studies HTCC Ceramic Substrates, HTCC Ceramic Shell/Housings, and HTCC SMD Ceramic Packages.

LTCC Ceramic Substrates is a type of multilayer ceramic substrate that made by lower temperature (usually from 850 to 900℃) firing process than general ceramic firing process by adding glass to alumina. It makes it possible to use low resistive conductor as conductor patterns in.

This report research and analyses the devices which made by the LTCC technology, mainly include LTCC components, LTCC Ceramic Substrates and LTCC modules.

The LTCC components include LC filters, directional coupler, power splitter and antenna etc. The LTCC ceramic substrates include Bluetooth substrates and mobile front-end module substrates, and the LTCC modules include phone antenna modules, Bluetooth modules and power amplifier modules etc.

LPI (LP Information)' newest research report, the “LTCC and HTCC Industry Forecast” looks at past sales and reviews total world LTCC and HTCC sales in 2022, providing a comprehensive analysis by region and market sector of projected LTCC and HTCC sales for 2023 through 2029. With LTCC and HTCC sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world LTCC and HTCC industry.

This Insight Report provides a comprehensive analysis of the global LTCC and HTCC landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on LTCC and HTCC portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global LTCC and HTCC market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for LTCC and HTCC and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global LTCC and HTCC.

The global LTCC and HTCC market size is projected to grow from US$ 3771.2 million in 2022 to US$ 5622.5 million in 2029; it is expected to grow at a CAGR of 5.9% from 2023 to 2029.

The global major manufacturers of HTCC include Kyocera, Maruwa, NGK Spark Plug, Hebei Sinopack Electronic Tech & CETC 13, and Chaozhou Three-Circle, etc. In terms of revenue, the global four largest players hold an 85% market share of HTCC.

In terms of HTCC products segment, HTCC Ceramic Shell/Housings and HTCC SMD Ceramic Packages hold a share 75.5% and 21.7%, respectively.

For HTCC Ceramic Shell/Housings, Kyocera, NGK/NTK, and Hebei Sinopack Electronic Tech & CETC 13 are the key producers, these three players occupied for about 84%, while for HTCC SMD Ceramic Packages, Kyocera and Chaozhou Three-Circle (Group) the world’s two largest players, both holds a share about 86 percent. For HTCC Ceramic Substrates, key players are Kyocera, Maruwa, NGK/NTK, NEO Tech, CETC 43 (Shengda Electronics), and Hebei Sinopack Electronic Tech. The global major manufacturers of LTCC include Murata, Kyocera, TDK Corporation, Yokowo, KOA Corporation, Bosch, ACX Corp, Taiyo Yuden, Taiyo Yuden, and Walsin Technology, etc. In terms of revenue, the global 3 largest players have a market share over 50%.

LTCC Components accounting for 66% of the LTCC global market.

This report presents a comprehensive overview, market shares, and growth opportunities of LTCC and HTCC market by product type, application, key players and key regions and countries.

Market Segmentation:

Segmentation by type
LTCC
HTCC

Segmentation by application
Consumer Electronics
Aerospace and Military
Automobile Electronics
Communication Package
Industrial
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Murata
TDK Corporation
Kyocera
Bosch
ACX Corp
Walsin Technology
Taiyo Yuden
Yageo
KOA Corporation
Samsung Electro-Mechanics
NEO Tech
Chilisin
Yokowo
Mini-Circuits
Adamant Namiki
Hitachi Metals
Shenzhen Sunlord
Microgate
MST
NTK/NGK
NIKKO
NeoCM
Elit Fine Ceramics
API Technologies (CMAC)
CETC 43rd Institute
IMST GmbH
Selmic
BDStar (Glead)
Fenghua Advanced
YanChuang Optoelectronic
Kyocera
Maruwa
NGK/NTK
Egide
NEO Tech
AdTech Ceramics
Ametek
Electronic Products, Inc. (EPI)
SoarTech
CETC 43 (Shengda Electronics)
Jiangsu Yixing Electronics
Chaozhou Three-Circle (Group)
Hebei Sinopack Electronic Tech & CETC 13
Beijing BDStar Navigation (Glead)
Fujian Minhang Electronics
RF Materials (METALLIFE)
CETC 55
Qingdao Kerry Electronics
Hebei Dingci Electronic
Shanghai Xintao Weixing Materials

Please note: The report will take approximately 2 business days to prepare and deliver.