Global IoT eSIM Chips Market Growth 2025-2031

The global IoT eSIM Chips market size is predicted to grow from US$ 1213 million in 2025 to US$ 1957 million in 2031; it is expected to grow at a CAGR of 8.3% from 2025 to 2031.

eSIM (Embedded SIM) is a Universal Integrated Circuit Card (UICC) that integrates software, hardware and secure elements. It is usually embedded in Internet of Things (IoT) devices instead of being pluggable like a traditional SIM card. The IoT eSIM chip is an IoT integrated circuit chip with wireless communication, sensor and data processing functions.

United States market for IoT eSIM Chips is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

China market for IoT eSIM Chips is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Europe market for IoT eSIM Chips is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Global key IoT eSIM Chips players cover Qualcomm, Samsung Semiconductor, ST Microelectronics, Infineon, Wuhan Tianyu Information, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.

LP Information, Inc. (LPI) ' newest research report, the “IoT eSIM Chips Industry Forecast” looks at past sales and reviews total world IoT eSIM Chips sales in 2024, providing a comprehensive analysis by region and market sector of projected IoT eSIM Chips sales for 2025 through 2031. With IoT eSIM Chips sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world IoT eSIM Chips industry.

This Insight Report provides a comprehensive analysis of the global IoT eSIM Chips landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on IoT eSIM Chips portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global IoT eSIM Chips market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for IoT eSIM Chips and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global IoT eSIM Chips.

This report presents a comprehensive overview, market shares, and growth opportunities of IoT eSIM Chips market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
5G
4G/5G Compatible

Segmentation by Application:
Smart Home
Industrial Automation
Intelligent Transportation
Smart Medical
Smart City

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Qualcomm
Samsung Semiconductor
ST Microelectronics
Infineon
Wuhan Tianyu Information
Unisoc
Tongxin Microelectronics
Eastcompeace Technology

Key Questions Addressed in this Report

What is the 10-year outlook for the global IoT eSIM Chips market?

What factors are driving IoT eSIM Chips market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do IoT eSIM Chips market opportunities vary by end market size?

How does IoT eSIM Chips break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.