Global Integrated Circuits (IC) Packaging & Testing Market Growth (Status and Outlook) 2024-2030

Global Integrated Circuits (IC) Packaging & Testing Market Growth (Status and Outlook) 2024-2030

A process wherein a semiconductor chip is packaged in a form suitable for the electronic device.

Semiconductor packaging is a process of protecting the chip from the external environment, and electrically packaging it to connect the terminals. The integrated circuit (IC) is a component of circuit boards and electronic devices. ICs need to be electrically packaged in a form fitting to where they’re installed. They are responsible for interconnects, supplying electrical power, and heat dissipation. Packaging also protects the semiconductor chips, shielding the integrated circuits from external factors such as high temperatures, impurities, and physical impact. Each chip is tested to verify normal operation after the packaging process has been completed. This testing is called the package test. The package test is conducted on finished chip products. Chips are placed in a testing apparatus and tested under various conditions to sort out defective products.

The semiconductor industry chain mainly includes three major processes: chip design, chip manufacturing, and packaging and testing. According to the different business models of packaging and testing companies, the business model is divided into two types: IDM and OSAT.

This report studies the Integrated Circuits (IC) Packaging and Testing Service.

The key IDMs include Samsung-Memory, Intel, SK Hynix, Micron Technology, Texas Instruments (TI), STMicroelectronics, Kioxia, Sony Semiconductor Solutions Corporation (SSS), Infineon, NXP, Analog Devices, Inc. (ADI), Renesas Electronics, Microchip Technology and Onsemi; and the key OSATs include ASE (SPIL), Amkor, JCET (STATS ChipPAC), Tongfu Microelectronics (TFME), Powertech Technology Inc. (PTI), Carsem, King Yuan Electronics Corp. (KYEC), SFA Semicon, Unisem Group, Chipbond Technology Corporation and ChipMOS TECHNOLOGIES, etc.

The global Integrated Circuits (IC) Packaging & Testing market size is projected to grow from US$ 91690 million in 2024 to US$ 124570 million in 2030; it is expected to grow at a CAGR of 5.2% from 2024 to 2030.

LPI (LP Information)' newest research report, the “Integrated Circuits (IC) Packaging & Testing Industry Forecast” looks at past sales and reviews total world Integrated Circuits (IC) Packaging & Testing sales in 2022, providing a comprehensive analysis by region and market sector of projected Integrated Circuits (IC) Packaging & Testing sales for 2023 through 2029. With Integrated Circuits (IC) Packaging & Testing sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Integrated Circuits (IC) Packaging & Testing industry.

This Insight Report provides a comprehensive analysis of the global Integrated Circuits (IC) Packaging & Testing landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Integrated Circuits (IC) Packaging & Testing portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Integrated Circuits (IC) Packaging & Testing market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Integrated Circuits (IC) Packaging & Testing and breaks down the forecast by Business Model, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Integrated Circuits (IC) Packaging & Testing.

Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.27% year-on-year.

This report presents a comprehensive overview, market shares, and growth opportunities of Integrated Circuits (IC) Packaging & Testing market by product type, application, key players and key regions and countries.

Segmentation by Business Model:
IDM
OSAT

Segmentation by Application:
Analog IC Packaging & Testing
MPU & MCUs IC Packaging & Testing
Logic IC Packaging & Testing
Memory IC Packaging & Testing

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

Segmentation by Business Model:
IDM
OSAT

Segmentation by Application:
Analog IC Packaging & Testing
MPU & MCUs IC Packaging & Testing
Logic IC Packaging & Testing
Memory IC Packaging & Testing

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Samsung
Intel
SK Hynix
Micron Technology
Texas Instruments (TI)
STMicroelectronics
Kioxia
Western Digital
Infineon
NXP
Analog Devices, Inc. (ADI)
Renesas
Microchip Technology
Onsemi
Sony Semiconductor Solutions Corporation
Panasonic
Winbond
Nanya Technology
ISSI (Integrated Silicon Solution Inc.)
Macronix
Giantec Semiconductor
Sharp
Magnachip
Toshiba
JS Foundry KK.
Hitachi
Murata
Skyworks Solutions Inc
Wolfspeed
Littelfuse
Diodes Incorporated
Rohm
Fuji Electric
Vishay Intertechnology
Mitsubishi Electric
Nexperia
Ampleon
CR Micro
Hangzhou Silan Integrated Circuit
ASE (SPIL)
Amkor
JCET (STATS ChipPAC)
Tongfu Microelectronics (TFME)
Powertech Technology Inc. (PTI)
Carsem
King Yuan Electronics Corp. (KYEC)
SFA Semicon
Unisem Group
Chipbond Technology Corporation
ChipMOS TECHNOLOGIES
OSE CORP.
Sigurd Microelectronics
Natronix Semiconductor Technology
Nepes
Forehope Electronic (Ningbo) Co.,Ltd.
Union Semiconductor（Hefei）Co., Ltd.
Hefei Chipmore Technology Co.,Ltd.
HT-tech
Chippacking

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