Global IC Packaging and Testing Service Market Growth (Status and Outlook) 2025-2031

The global IC Packaging and Testing Service market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR of %from 2025 to 2031.

The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.

LPI (LP Information)' newest research report, the “IC Packaging and Testing Service Industry Forecast” looks at past sales and reviews total world IC Packaging and Testing Service sales in 2024, providing a comprehensive analysis by region and market sector of projected IC Packaging and Testing Service sales for 2025 through 2031. With IC Packaging and Testing Service sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world IC Packaging and Testing Service industry.

This Insight Report provides a comprehensive analysis of the global IC Packaging and Testing Service landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on IC Packaging and Testing Service portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global IC Packaging and Testing Service market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for IC Packaging and Testing Service and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global IC Packaging and Testing Service.

This report presents a comprehensive overview, market shares, and growth opportunities of IC Packaging and Testing Service market by product type, application, key players and key regions and countries.

Segmentation by Type:
IDM
OSAT

Segmentation by Application:
Communication
Automotive Electronics
Industrial
Consumer Electronics
Computing and Networking
Other

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Intel
Samsung
SK Hynix
Micron
ASE Group
Amkor Technology, Inc.
Huatian Technology
Powertech Technology, Inc.
Chipbond
Presto Engineering
JECT
Siliconware Precision Industries Co., Ltd.
Tongfu Microelectronics
Tower Semiconductor
Qualcomm
MediaTek
UMC
Apple
IBM
Graphcore
ADLINK
Kioxia
Texas Instruments
TSMC
Analog Devices
Sony
Infineon
Bosch
onsemi
Mitsubishi Electric
Micross
UTAC
KYEC
ChipMOS
China Resources Group

Please note: The report will take approximately 2 business days to prepare and deliver.