Global IC Packaging Substrate Market Growth 2023-2029

Global IC Packaging Substrate Market Growth 2023-2029

IC packaging substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging.
LPI (LP Information)' newest research report, the “IC Packaging Substrate Industry Forecast” looks at past sales and reviews total world IC Packaging Substrate sales in 2022, providing a comprehensive analysis by region and market sector of projected IC Packaging Substrate sales for 2023 through 2029. With IC Packaging Substrate sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world IC Packaging Substrate industry.
This Insight Report provides a comprehensive analysis of the global IC Packaging Substrate landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on IC Packaging Substrate portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global IC Packaging Substrate market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for IC Packaging Substrate and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global IC Packaging Substrate.
The global IC Packaging Substrate market size is projected to grow from US$ million in 2022 to US$ million in 2029; it is expected to grow at a CAGR of % from 2023 to 2029.
United States market for IC Packaging Substrate is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.
China market for IC Packaging Substrate is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.
Europe market for IC Packaging Substrate is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.
Global key IC Packaging Substrate players cover Ibiden, Kinsus Interconnect Technology, Unimicron, Shinko Electric Industries, Semco, Simmtech, Nanya, Kyocera and LG Innotek, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2022.
This report presents a comprehensive overview, market shares, and growth opportunities of IC Packaging Substrate market by product type, application, key manufacturers and key regions and countries.
Market Segmentation:
Segmentation by type
WB CSP
FC BGA
FC CSP
PBGA
SiP
BOC
Other
Segmentation by application
Smart Phones
PC (Tablet, Laptop)
Wearable Devices
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Ibiden
Kinsus Interconnect Technology
Unimicron
Shinko Electric Industries
Semco
Simmtech
Nanya
Kyocera
LG Innotek
AT&S
ASE
Daeduck
Shennan Circuit
Zhen Ding Technology
KCC (Korea Circuit Company)
ACCESS
Shenzhen Fastprint Circuit Tech
AKM Meadville
Toppan Printing
Key Questions Addressed in this Report
What is the 10-year outlook for the global IC Packaging Substrate market?
What factors are driving IC Packaging Substrate market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do IC Packaging Substrate market opportunities vary by end market size?
How does IC Packaging Substrate break out type, application?
What are the influences of COVID-19 and Russia-Ukraine war?

Please note: The report will take approximately 2 business days to prepare and deliver.