Global IC Package Substrates Market Growth 2025-2031

The global IC Package Substrates market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR of %from 2025 to 2031.

IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging, and the share of IC substrate for IC packaging is as high as 35-55%.

The major manufacturers that provide IC Package Substrates in China include SCC, Nanya and Access Substrates, etc. The top three manufacturers account for more than 50% of the market share. Among them, WB BGA and FC-CSP accounted for 39% and 38%, respectively. Smartphones and PCs (tablets and laptops) are the most widely used, accounting for 64% and 23%, respectively.

LP Information, Inc. (LPI) ' newest research report, the “IC Package Substrates Industry Forecast” looks at past sales and reviews total world IC Package Substrates sales in 2024, providing a comprehensive analysis by region and market sector of projected IC Package Substrates sales for 2025 through 2031. With IC Package Substrates sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world IC Package Substrates industry.

This Insight Report provides a comprehensive analysis of the global IC Package Substrates landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on IC Package Substrates portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global IC Package Substrates market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for IC Package Substrates and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global IC Package Substrates.

This report presents a comprehensive overview, market shares, and growth opportunities of IC Package Substrates market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:

FC-BGA

FC-CSP

WB BGA

WB CSP

RF Module

Others

Segmentation by Application:

Smart Phone

PC (tablet and Laptop)

Wearable Device

Others

This report also splits the market by region:

Americas

United States

Canada

Mexico

Brazil

APAC

China

Japan

Korea

Southeast Asia

India

Australia

Europe

Germany

France

UK

Italy

Russia

Middle East & Africa

Egypt

South Africa

Israel

Turkey

GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.

Unimicron

Ibiden

Nan Ya PCB

Shinko Electric Industries

Kinsus Interconnect Technology

AT&S

Semco

Kyocera

TOPPAN

Zhen Ding Technology

Daeduck Electronics

ASE Material

LG InnoTek

Simmtech

Shennan Circuit

Shenzhen Fastprint Circuit Tech

ACCESS

Suntak Technology

National Center for Advanced Packaging (NCAP China)

Huizhou China Eagle Electronic Technology

DSBJ

Shenzhen Kinwong Electronic

AKM Meadville

Victory Giant Technology

Key Questions Addressed in this Report

What is the 10-year outlook for the global IC Package Substrates market?

What factors are driving IC Package Substrates market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do IC Package Substrates market opportunities vary by end market size?

How does IC Package Substrates break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.